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ZHCSOD9D October 2005 – July 2024 MAX3221E

PRODUCTION DATA

5.5 Thermal Information

THERMAL METRIC⁽¹⁾		MAX3221E		UNIT
		DB (SSOP)	PW (TSSOP)
		16 PINS	16 PINS
R_θJA	Junction-to-ambient thermal resistance	105.8	110.9	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	51.9	41.7	°C/W
R_θJB	Junction-to-board thermal resistance	57.6	57.2	°C/W
ψ_JT	Junction-to-top characterization parameter	14.1	4.2	°C/W
ψ_JB	Junction-to-board characterization parameter	56.8	56.6	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.