ZHCSOM9C January 2006 – January 2023 MAX3222E
PRODUCTION DATA
| THERMAL METRIC(1) | MAX3222E | UNIT | |||
|---|---|---|---|---|---|
| DB (SSOP) | DW (SOIC) | PW (TSSOP) | |||
| 20 Pins | 20 Pins | 20 Pins | |||
| R θJA | Junction-to-ambient thermal resistance | 91.0 | 58.0 | 94.1 | °C/W |
| R θJC(top) | Junction-to-case (top) thermal resistance | 46.2 | 30.0 | 35.2 | °C/W |
| R θJB | Junction-to-board thermal resistance | 46.1 | 29.6 | 45.5 | °C/W |
| ψ JT | Junction-to-top characterization parameter | 12.3 | 7.7 | 3.1 | °C/W |
| ψ JB | Junction-to-board characterization parameter | 45.6 | 29.3 | 45.1 | °C/W |