ZHCSR58E April   2005  – October 2022 MAX3243E

PRODUCTION DATA  

  1. 特性
  2. 应用
  3. 说明
  4. Revision History
  5. 说明(续)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  ESD Ratings - IEC Specifications
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Thermal Information
    6. 7.6  Electrical Characteristics
    7. 7.7  Driver Electrical Characteristics
    8. 7.8  Receiver, Electrical Characteristics
    9. 7.9  Auto-Powerdown Electrical Characteristics
    10. 7.10 Driver Switching Characteristics
    11. 7.11 Receiver Switching Characteristics
    12. 7.12 Auto-Powerdown Switching Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 ESD Protection
          1. 10.2.2.1.1 ESD Test Conditions
          2. 10.2.2.1.2 Human Body Model (HBM)
          3. 10.2.2.1.3 IEC61000-4-2 (Formerly Known as IEC1000-4-2)
          4. 10.2.2.1.4 Machine Model
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Example
        1.       Device and Documentation Support
          1. 11.1 Receiving Notification of Documentation Updates
          2. 11.2 支持资源
          3. 11.3 Trademarks
          4. 11.4 Electrostatic Discharge Caution
          5. 11.5 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

说明

MAX3243E 器件由三个线路驱动器、五个线路接收器和一个双电荷泵电路组成,在串行端口连接引脚上具有 ±15kV ESD(HBM 和 IEC61000-4-2,空气间隙放电)和 ±8kV ESD(IEC61000-4-2,接触放电)保护。该器件符合 TIA/EIA-232-F 的要求并在异步通信控制器与串行端口连接器之间提供电气接口。这种驱动器和接收器的组合可满足对在 IBM PC/AT 中使用的典型串行端口的需求或与之兼容。电荷泵和四个小型外部电容器支持由 3V 至 5.5V 单电源供电。另外,该器件包括一个始终有效同相输出 (ROUT2B),这使得使用振铃指示的应用能够在器件断电的情况下发送数据。

封装信息
器件型号封装(1)封装尺寸(标称值)
MAX3243ESSOP (DB) (28)10,20 mm × 5,30 mm
SOIC (DW) (28)17,90 mm × 7,50 mm
TSSOP (PW) (28)9,70mm × 4,40mm
VQFN (RHB) (32)5,00mm × 5,00mm
如需了解所有可用封装,请参阅数据表末尾的可订购米6体育平台手机版_好二三四附录。
简化版电路