4.1 Pin Diagrams

Figure 4-1 shows the pinout for the MSP430F5229 and MSP430F5227 devices in the 64-pin RGC package.

A.

NOTE:

TI recommends connection of exposed thermal pad to V_SS.

Figure 4-1 64-Pin RGC Package – F5229, F5227

Figure 4-2 shows the pinout for the MSP430F5224 and MSP430F5222 devices in the 48-pin RGZ package.

A.

NOTE:

TI recommends connection of exposed thermal pad to V_SS.

Figure 4-2 48-Pin RGZ Package – F5224, F5222

Figure 4-3 shows the pinout for the MSP430F5219 and MSP430F5217 devices in the 64-pin RGC package.

A.

NOTE:

TI recommends connection of exposed thermal pad to V_SS.

Figure 4-3 64-Pin RGC Package – F5219, F5217

Figure 4-4 shows the pinout for the MSP430F5214 and MSP430F5212 devices in the 48-pin RGZ package.

A.

NOTE:

TI recommends connection of exposed thermal pad to V_SS.

Figure 4-4 48-Pin RGZ Package – F5214, F5212

Figure 4-5 shows the pinout for the MSP430F5229, MSP430F5227, MSP430F5219, and MSP430F5217 devices in the 80-pin ZQE package.

Figure 4-5 80-Pin ZQE Package – F5229, F5227, F5219, F5217

Figure 4-6 shows the pinout for the MSP430F5229, MSP430F5227, MSP430F5219, and MSP430F5217 devices in the 64-pin YFF package.

Figure 4-6 64-Pin YFF Package – F5229, F5227, F5219, F5217