ZHCSAJ5H November 2012 – September 2018 MSP430F5212 , MSP430F5214 , MSP430F5217 , MSP430F5219 , MSP430F5222 , MSP430F5224 , MSP430F5229
PRODUCTION DATA.
- 1器件概述
- 2修订历史记录
- 3Device Comparison
- 4Terminal Configuration and Functions
-
5Specifications
- 5.1 Absolute Maximum Ratings
- 5.2 ESD Ratings
- 5.3 Recommended Operating Conditions
- 5.4 Active Mode Supply Current Into VCC Excluding External Current
- 5.5 Low-Power Mode Supply Currents (Into VCC) Excluding External Current
- 5.6 Thermal Resistance Characteristics
- 5.7 Schmitt-Trigger Inputs – General-Purpose I/O DVCC Domain (P1.0 to P1.3, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3, RSTDVCC)
- 5.8 Schmitt-Trigger Inputs – General-Purpose I/O DVIO Domain (P1.4 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5, RST/NMI, BSLEN)
- 5.9 Inputs – Interrupts DVCC Domain Port P1 (P1.0 to P1.3)
- 5.10 Inputs – Interrupts DVIO Domain Ports P1 and P2 (P1.4 to P1.7, P2.0 to P2.7)
- 5.11 Leakage Current – General-Purpose I/O DVCC Domain (P1.0 to P1.3, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
- 5.12 Leakage Current – General-Purpose I/O DVIO Domain (P1.4 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5)
- 5.13 Outputs – General-Purpose I/O DVCC Domain (Full Drive Strength) (P1.0 to P1.3, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
- 5.14 Outputs – General-Purpose I/O DVCC Domain (Reduced Drive Strength) (P1.0 to P1.3, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
- 5.15 Outputs – General-Purpose I/O DVIO Domain (Full Drive Strength) (P1.4 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5)
- 5.16 Outputs – General-Purpose I/O DVIO Domain (Reduced Drive Strength) (P1.4 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5)
- 5.17 Output Frequency – General-Purpose I/O DVCC Domain (P1.0 to P1.3, P5.0 to P5.5, P6.0 to P6.7, PJ.0 to PJ.3)
- 5.18 Output Frequency – General-Purpose I/O DVIO Domain (P1.4 to P1.7, P2.0 to P2.7, P3.0 to P3.4, P4.0 to P4.7, P7.0 to P7.5)
- 5.19 Typical Characteristics – Outputs, Reduced Drive Strength (PxDS.y = 0)
- 5.20 Typical Characteristics – Outputs, Full Drive Strength (PxDS.y = 1)
- 5.21 Crystal Oscillator, XT1, Low-Frequency Mode
- 5.22 Crystal Oscillator, XT2
- 5.23 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
- 5.24 Internal Reference, Low-Frequency Oscillator (REFO)
- 5.25 DCO Frequency
- 5.26 PMM, Brownout Reset (BOR)
- 5.27 PMM, Core Voltage
- 5.28 PMM, SVS High Side
- 5.29 PMM, SVM High Side
- 5.30 PMM, SVS Low Side
- 5.31 PMM, SVM Low Side
- 5.32 Wake-up Times From Low-Power Modes and Reset
- 5.33 Timer_A
- 5.34 Timer_B
- 5.35 USCI (UART Mode), Recommended Operating Conditions
- 5.36 USCI (UART Mode)
- 5.37 USCI (SPI Master Mode), Recommended Operating Conditions
- 5.38 USCI (SPI Master Mode)
- 5.39 USCI (SPI Slave Mode)
- 5.40 USCI (I2C Mode)
- 5.41 10-Bit ADC, Power Supply and Input Range Conditions
- 5.42 10-Bit ADC, Timing Parameters
- 5.43 10-Bit ADC, Linearity Parameters
- 5.44 REF, External Reference
- 5.45 REF, Built-In Reference
- 5.46 Comparator_B
- 5.47 Flash Memory
- 5.48 JTAG and Spy-Bi-Wire Interface
- 5.49 DVIO BSL Entry
-
6Detailed Description
- 6.1 CPU (Link to user's guide)
- 6.2 Operating Modes
- 6.3 Interrupt Vector Addresses
- 6.4 Memory Organization
- 6.5 Bootloader (BSL)
- 6.6 JTAG Operation
- 6.7 Flash Memory (Link to user's guide)
- 6.8 RAM (Link to user's guide)
- 6.9
Peripherals
- 6.9.1 Digital I/O (Link to user's guide)
- 6.9.2 Port Mapping Controller (Link to user's guide)
- 6.9.3 Oscillator and System Clock (Link to user's guide)
- 6.9.4 Power-Management Module (PMM) (Link to user's guide)
- 6.9.5 Hardware Multiplier (Link to user's guide)
- 6.9.6 Real-Time Clock (RTC_A) (Link to user's guide)
- 6.9.7 Watchdog Timer (WDT_A) (Link to user's guide)
- 6.9.8 System Module (SYS) (Link to user's guide)
- 6.9.9 DMA Controller (Link to user's guide)
- 6.9.10 Universal Serial Communication Interface (USCI) (Links to user's guide: UART Mode, SPI Mode, I2C Mode)
- 6.9.11 TA0 (Link to user's guide)
- 6.9.12 TA1 (Link to user's guide)
- 6.9.13 TA2 (Link to user's guide)
- 6.9.14 TB0 (Link to user's guide)
- 6.9.15 Comparator_B (Link to user's guide)
- 6.9.16 ADC10_A (Link to user's guide)
- 6.9.17 CRC16 (Link to user's guide)
- 6.9.18 REF Voltage Reference (Link to user's guide)
- 6.9.19 Embedded Emulation Module (EEM) (S Version) (Link to user's guide)
- 6.9.20 Peripheral File Map
- 6.10
Input/Output Diagrams
- 6.10.1 Port P1 (P1.0 to P1.7) Input/Output With Schmitt Trigger
- 6.10.2 Port P2 (P2.0 to P2.7) Input/Output With Schmitt Trigger
- 6.10.3 Port P3 (P3.0 to P3.4) Input/Output With Schmitt Trigger
- 6.10.4 Port P4 (P4.0 to P4.7) Input/Output With Schmitt Trigger
- 6.10.5 Port P5 (P5.0 and P5.1) Input/Output With Schmitt Trigger
- 6.10.6 Port P5 (P5.2) Input/Output With Schmitt Trigger
- 6.10.7 Port P5 (P5.3) Input/Output With Schmitt Trigger
- 6.10.8 Port P5 (P5.4 and P5.5) Input/Output With Schmitt Trigger
- 6.10.9 Port P6 (P6.0 to P6.7) Input/Output With Schmitt Trigger
- 6.10.10 Port P7 (P7.0 to P7.5) Input/Output With Schmitt Trigger
- 6.10.11 Port PJ (PJ.0) JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
- 6.10.12 Port PJ (PJ.1 to PJ.3) JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
- 6.11 Device Descriptors
- 7器件和文档支持
- 8机械、封装和可订购信息
封装选项
机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
- RGC|64
订购信息
7.2 Device Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all MSP MCU devices. Each MSP MCU commercial family member has one of two prefixes: MSP or XMS. These prefixes represent evolutionary stages of product development from engineering prototypes (XMS) through fully qualified production devices (MSP).
XMS – Experimental device that is not necessarily representative of the final device's electrical specifications
MSP – Fully qualified production device
XMS devices are shipped against the following disclaimer:
"Developmental product is intended for internal evaluation purposes."
MSP devices have been characterized fully, and the quality and reliability of the device have been demonstrated fully. TI's standard warranty applies.
Predictions show that prototype devices (XMS) have a greater failure rate than the standard production devices. TI recommends that these devices not be used in any production system because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the temperature range, package type, and distribution format. Figure 7-1 provides a legend for reading the complete device name.
Figure 7-1 Device Nomenclature