5.6 Thermal Resistance Characteristics(1)
| THERMAL METRIC |
VALUE |
UNIT |
| RθJA |
Junction-to-ambient thermal resistance, still air (2) |
VQFN (RGC) |
30 |
°C/W |
| VQFN (RGZ) |
28.6 |
| LQFP (PT) |
62.8 |
| BGA (ZQE) |
55.5 |
| RθJC(TOP) |
Junction-to-case (top) thermal resistance (3) |
VQFN (RGC) |
15.6 |
°C/W |
| VQFN (RGZ) |
14.4 |
| LQFP (PT) |
18.2 |
| BGA (ZQE) |
21.2 |
| RθJC(BOTTOM) |
Junction-to-case (bottom) thermal resistance (4) |
VQFN (RGC) |
1.6 |
°C/W |
| VQFN (RGZ) |
1.6 |
| LQFP (PT) |
N/A |
| BGA (ZQE) |
N/A |
| RθJB |
Junction-to-board thermal resistance (5) |
VQFN (RGC) |
8.9 |
°C/W |
| VQFN (RGZ) |
5.5 |
| LQFP (PT) |
28.3 |
| BGA (ZQE) |
19.3 |
(1) N/A = not applicable
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case(top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-case(bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(5) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8.