ZHCS897K July 2009 – September 2018 MSP430F5500 , MSP430F5501 , MSP430F5502 , MSP430F5503 , MSP430F5504 , MSP430F5505 , MSP430F5506 , MSP430F5507 , MSP430F5508 , MSP430F5509 , MSP430F5510
PRODUCTION DATA.
Figure 4-1 shows the pinout for the 64-pin RGC package of the MSP430F5510, MSP430F5509, and MSP430F5508 MCUs.
NOTE:
TI recommends connection of the exposed thermal pad to VSS.Figure 4-2 shows the pinout for the 80-pin ZQE package of the MSP430F5510, MSP430F5509, and MSP430F5508 MCUs. See Section 4.2 for the pin assignments.
Figure 4-3 shows the pinout for 48-pin RGZ and PT packages of the MSP430F5510, MSP430F5509, and MSP430F5508 MCUs.
NOTE:
TI recommends connection of the exposed thermal pad to VSS.Figure 4-4 shows the pinout for the 48-pin RGZ and PT packages of the MSP430F5507, MSP430F5506, MSP430F5505, and MSP430F5504 MCUs.
NOTE:
TI recommends connection of the exposed thermal pad to VSS.Figure 4-5 shows the pinout for the 48-pin RGZ package of the MSP430F5503, MSP430F5502, MSP430F5501, and MSP430F5500 MCUs.
NOTE:
TI recommends connection of the exposed thermal pad to VSS.