ZHCS897K July 2009 – September 2018 MSP430F5500 , MSP430F5501 , MSP430F5502 , MSP430F5503 , MSP430F5504 , MSP430F5505 , MSP430F5506 , MSP430F5507 , MSP430F5508 , MSP430F5509 , MSP430F5510
PRODUCTION DATA.
VALUE(1) | UNIT | ||||
---|---|---|---|---|---|
θJA | Junction-to-ambient thermal resistance, still air(2) | VQFN (RGC) | 30 | °C/W | |
VQFN (RGZ) | 28.6 | ||||
LQFP (PT) | 62.8 | ||||
BGA (ZQE) | 55.5 | ||||
θJC(TOP) | Junction-to-case (top) thermal resistance(3) | VQFN (RGC) | 15.6 | °C/W | |
VQFN (RGZ) | 14.4 | ||||
LQFP (PT) | 18.2 | ||||
BGA (ZQE) | 21.2 | ||||
θJC(BOTTOM) | Junction-to-case (bottom) thermal resistance(4) | VQFN(RGC) | 1.6 | °C/W | |
VQFN (RGZ) | 1.6 | ||||
LQFP (PT) | N/A | ||||
BGA (ZQE) | N/A | ||||
θJB | Junction-to-board thermal resistance(5) | VQFN (RGC) | 8.9 | °C/W | |
VQFN (RGZ) | 5.5 | ||||
LQFP (PT) | 28.3 | ||||
BGA (ZQE) | 19.3 |