4.1 Pin Diagrams

Figure 4-1 shows the pinout for the MSP430F5529, MSP430F5527, MSP430F5525, and MSP430F5521 devices in the 80-pin PN package.

Figure 4-1 80-Pin PN Package – MSP430F5529IPN, MSP430F5527IPN, MSP430F5525IPN, MSP430F5521IPN (Top View)

Figure 4-2 shows the pinout for the MSP430F5528, MSP430F5526, MSP430F5524, and MSP430F5522 devices in the 64-pin RGC package.

A.

NOTE:

TI recommends connecting the exposed thermal pad to V_SS.

Figure 4-2 64-Pin RGC Package – MSP430F5528IRGC, MSP430F5526IRGC, MSP430F5524IRGC, MSP430F5522IRGC (Top View)

Figure 4-3 shows the pinout for the MSP430F5519, MSP430F5517, and MSP430F5515 devices in the 80-pin PN package.

Figure 4-3 80-Pin PN Package – MSP430F5519IPN, MSP430F5517IPN, MSP430F5515IPN (Top View)

Figure 4-4 shows the pinout for the MSP430F5514 and MSP430F5513 devices in the 64-pin RGC package.

A.

NOTE:

TI recommends connecting the exposed thermal pad to V_SS.

Figure 4-4 64-Pin RGC Package – MSP430F5514IRGC, MSP430F5513IRGC (Top View)

Figure 4-5 shows the pinout for the MSP430F5528, MSP430F5526, MSP430F5524, MSP430F5522, MSP430F5514, and MSP430F5513 devices in the 80-pin ZQE package.

Figure 4-5 80-Pin ZQE Package – MSP430F5528IZQE, MSP430F5526IZQE, MSP430F5524IZQE, MSP430F5522IZQE, MSP430F5514IZQE, MSP430F5513IZQE (Top View)

Figure 4-6 shows the pinout for the MSP430F5528, MSP430F5526, and MSP430F5524 devices in the 64-pin YFF package. For package dimensions, see the Mechanical Data in Section 8.

Figure 4-6 64-Pin YFF Package – MSP430F5528IYFF, MSP430F5526IYFF, MSP430F5524IYFF