ZHCSCI2A June   2014  – October 2018 MSP430F67621 , MSP430F67641

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 应用图表
  2. 2修订历史记录
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions – PZ Package
      2. Table 4-2 Signal Descriptions – PN Package
    3. 4.3 Pin Multiplexing
    4. 4.4 Connection of Unused Pins
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5 Low-Power Mode Supply Currents (Into VCC) Excluding External Current
    6. 5.6 Low-Power Mode With LCD Supply Currents (Into VCC) Excluding External Current
    7. 5.7 Thermal Resistance Characteristics
    8. 5.8 Timing and Switching Characteristics
      1. 5.8.1  Clock Specifications
        1. Table 5-1 Crystal Oscillator, XT1, Low-Frequency Mode
        2. Table 5-2 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        3. Table 5-3 Internal Reference, Low-Frequency Oscillator (REFO)
        4. Table 5-4 DCO Frequency
      2. 5.8.2  Digital I/O Ports
        1. Table 5-5  Schmitt-Trigger Inputs – General-Purpose I/O
        2. Table 5-6  Inputs – Ports P1 and P2
        3. Table 5-7  Leakage Current – General-Purpose I/O
        4. Table 5-8  Outputs – General-Purpose I/O (Full Drive Strength)
        5. Table 5-9  Typical Characteristics – General-Purpose I/O (Full Drive Strength)
        6. Table 5-10 Outputs – General-Purpose I/O (Reduced Drive Strength)
        7. 5.8.2.1    Typical Characteristics – General-Purpose I/O (Reduced Drive Strength)
        8. Table 5-11 Output Frequency – General-Purpose I/O
      3. 5.8.3  Power-Management Module (PMM)
        1. Table 5-12 PMM, Brownout Reset (BOR)
        2. Table 5-13 PMM, Core Voltage
        3. Table 5-14 PMM, SVS High Side
        4. Table 5-15 PMM, SVM High Side
        5. Table 5-16 PMM, SVS Low Side
        6. Table 5-17 PMM, SVM Low Side
        7. Table 5-18 Wake-up Times From Low-Power Modes and Reset
      4. 5.8.4  Auxiliary Supplies
        1. Table 5-19 Auxiliary Supplies, Recommended Operating Conditions
        2. Table 5-20 Auxiliary Supplies, AUXVCC3 (Backup Subsystem) Currents
        3. Table 5-21 Auxiliary Supplies, Auxiliary Supply Monitor
        4. Table 5-22 Auxiliary Supplies, Switch ON-Resistance
        5. Table 5-23 Auxiliary Supplies, Switching Time
        6. Table 5-24 Auxiliary Supplies, Switch Leakage
        7. Table 5-25 Auxiliary Supplies, Auxiliary Supplies to ADC10_A
        8. Table 5-26 Auxiliary Supplies, Charge Limiting Resistor
      5. 5.8.5  Timer_A
        1. Table 5-27 Timer_A
      6. 5.8.6  eUSCI
        1. Table 5-28 eUSCI (UART Mode) Clock Frequency
        2. Table 5-29 eUSCI (UART Mode) Switching Characteristics
        3. Table 5-30 eUSCI (SPI Master Mode) Clock Frequency
        4. Table 5-31 eUSCI (SPI Master Mode) Switching Characteristics
        5. Table 5-32 eUSCI (SPI Slave Mode)
        6. Table 5-33 eUSCI (I2C Mode)
      7. 5.8.7  LCD Controller
        1. Table 5-34 LCD_C Recommended Operating Conditions
        2. Table 5-35 LCD_C Electrical Characteristics
      8. 5.8.8  SD24_B
        1. Table 5-36 SD24_B Power Supply and Recommended Operating Conditions
        2. Table 5-37 SD24_B Analog Input
        3. Table 5-38 SD24_B Supply Currents
        4. Table 5-39 SD24_B Performance
        5. Table 5-40 SD24_B AC Performance
        6. Table 5-41 SD24_B AC Performance
        7. Table 5-42 SD24_B AC Performance
        8. Table 5-43 SD24_B External Reference Input
      9. 5.8.9  ADC10_A
        1. Table 5-44 10-Bit ADC, Power Supply and Input Range Conditions
        2. Table 5-45 10-Bit ADC, Timing Parameters
        3. Table 5-46 10-Bit ADC, Linearity Parameters
        4. Table 5-47 10-Bit ADC, External Reference
      10. 5.8.10 REF
        1. Table 5-48 REF, Built-In Reference
      11. 5.8.11 Flash Memory
        1. Table 5-49 Flash Memory
      12. 5.8.12 Emulation and Debug
        1. Table 5-50 JTAG and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  Functional Block Diagrams
    3. 6.3  CPU
    4. 6.4  Instruction Set
    5. 6.5  Operating Modes
    6. 6.6  Interrupt Vector Addresses
    7. 6.7  Memory Organization
    8. 6.8  Bootloader (BSL)
    9. 6.9  JTAG Operation
      1. 6.9.1 JTAG Standard Interface
      2. 6.9.2 Spy-Bi-Wire Interface
    10. 6.10 Flash Memory
    11. 6.11 RAM
    12. 6.12 Backup RAM
    13. 6.13 Peripherals
      1. 6.13.1  Oscillator and System Clock
      2. 6.13.2  Power Management Module (PMM)
      3. 6.13.3  Auxiliary Supply System (AUX)
      4. 6.13.4  Backup Subsystem
      5. 6.13.5  Digital I/O
      6. 6.13.6  Port Mapping Controller
      7. 6.13.7  System Module (SYS)
      8. 6.13.8  Watchdog Timer (WDT_A)
      9. 6.13.9  DMA Controller
      10. 6.13.10 CRC16
      11. 6.13.11 Hardware Multiplier
      12. 6.13.12 Enhanced Universal Serial Communication Interface (eUSCI)
      13. 6.13.13 ADC10_A
      14. 6.13.14 SD24_B
      15. 6.13.15 TA0
      16. 6.13.16 TA1
      17. 6.13.17 TA2
      18. 6.13.18 TA3
      19. 6.13.19 SD24_B Triggers
      20. 6.13.20 ADC10_A Triggers
      21. 6.13.21 Real-Time Clock (RTC_C)
      22. 6.13.22 Reference (REF) Module Voltage Reference
      23. 6.13.23 LCD_C
      24. 6.13.24 Embedded Emulation Module (EEM) (S Version)
      25. 6.13.25 Peripheral File Map
    14. 6.14 Input/Output Diagrams
      1. 6.14.1  Port P1 (P1.0 and P1.1) Input/Output With Schmitt Trigger
      2. 6.14.2  Port P1 (P1.2), Input/Output With Schmitt Trigger
      3. 6.14.3  Port P1 (P1.3 to P1.5) Input/Output With Schmitt Trigger
      4. 6.14.4  Port P1 (P1.6 and P1.7), Port P2 (P2.0 and P2.1) (PZ Package Only) Input/Output With Schmitt Trigger
      5. 6.14.5  Port P2 (P2.2 to P2.7) Input/Output With Schmitt Trigger (PZ Package Only)
      6. 6.14.6  Port P3 (P3.0 to P3.3) Input/Output With Schmitt Trigger (PZ Package Only)
      7. 6.14.7  Port P3 (P3.4 to P3.7) Input/Output With Schmitt Trigger (PZ Package Only)
      8. 6.14.8  Port P4 (P4.0 to P4.7), Port P5 (P5.0 to P5.7), Port P6 (P6.0 to P6.7), Port P7 (P7.0 to P7.7), Port P8 (P8.0 to P8.3) Input/Output With Schmitt Trigger (PZ Package Only)
      9. 6.14.9  Port P8 (P8.4 to P8.7) Input/Output With Schmitt Trigger (PZ Package Only)
      10. 6.14.10 Port P9 (P9.0) Input/Output With Schmitt Trigger (PZ Package Only)
      11. 6.14.11 Port P9 (P9.1 to P9.3) Input/Output With Schmitt Trigger (PZ Package Only)
      12. 6.14.12 Port P2 (P2.0 and P2.1) Input/Output With Schmitt Trigger (PN Package Only)
      13. 6.14.13 Port P2 (P2.2 to P2.7) Input/Output With Schmitt Trigger (PN Package Only)
      14. 6.14.14 Port P3 (P3.0 to P3.7) Input/Output With Schmitt Trigger (PN Package Only)
      15. 6.14.15 Port P4 (P4.0 to P4.7), Port P5 (P5.0 to P5.7), Port P6 (P6.0 to P6.7) Input/Output With Schmitt Trigger (PN Package Only)
      16. 6.14.16 Port PJ (PJ.0) JTAG Pin TDO, Input/Output With Schmitt Trigger or Output
      17. 6.14.17 Port PJ (PJ.1 to PJ.3) JTAG Pins TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger or Output
    15. 6.15 Device Descriptors (TLV)
    16. 6.16 Identification
      1. 6.16.1 Revision Identification
      2. 6.16.2 Device Identification
      3. 6.16.3 JTAG Identification
  7. 7Applications, Implementation, and Layout
  8. 8器件和文档支持
    1. 8.1 入门和后续步骤
    2. 8.2 Device Nomenclature
    3. 8.3 工具与软件
    4. 8.4 文档支持
    5. 8.5 相关链接
    6. 8.6 社区资源
    7. 8.7 商标
    8. 8.8 静电放电警告
    9. 8.9 Glossary
  9. 9机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Table 5-1 Crystal Oscillator, XT1, Low-Frequency Mode(5)

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP MAX UNIT
ΔIDVCC.LF Differential XT1 oscillator crystal current consumption from lowest drive setting, LF mode fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 1, TA = 25°C 3.0 V 0.075 µA
fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 2, TA = 25°C 0.170
fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 3, TA = 25°C 0.290
fXT1,LF0 XT1 oscillator crystal frequency, LF mode XTS = 0, XT1BYPASS = 0 32768 Hz
fXT1,LF,SW XT1 oscillator logic-level square-wave input frequency, LF mode XTS = 0, XT1BYPASS = 1(6)(7) 10 32.768 50 kHz
OALF Oscillation allowance for LF crystals(8) XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 0, fXT1,LF = 32768 Hz, CL,eff = 6 pF 210 kΩ
XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 1, fXT1,LF = 32768 Hz, CL,eff = 12 pF 300
CL,eff Integrated effective load capacitance, LF mode(1) XTS = 0, XCAPx = 0(2) 1 pF
XTS = 0, XCAPx = 1 5.5
XTS = 0, XCAPx = 2 8.5
XTS = 0, XCAPx = 3 12.0
Duty cycle, LF mode XTS = 0, Measured at ACLK,
fXT1,LF = 32768 Hz		 30% 70%
fFault,LF Oscillator fault frequency, LF mode(4) XTS = 0(3) 10 10000 Hz
tSTART,LF Start-up time, LF mode fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 0, TA = 25°C, CL,eff = 6 pF 3.0 V 1000 ms
fOSC = 32768 Hz, XTS = 0, XT1BYPASS = 0, XT1DRIVEx = 3, TA = 25°C, CL,eff = 12 pF 500
(1) Includes parasitic bond and package capacitance (approximately 2 pF per pin).
Because the PCB adds additional capacitance, TI recommends verifying the correct load by measuring the ACLK frequency. For a correct setup, the effective load capacitance should always match the specification of the used crystal.
(2) Requires external capacitors at both terminals. Values are specified by crystal manufacturers.
(3) Measured with logic-level input frequency but also applies to operation with crystals.
(4) Frequencies below the MIN specification set the fault flag. Frequencies above the MAX specification do not set the fault flag. Frequencies between the MIN and MAX specifications might set the flag.
(5) To improve EMI on the XT1 oscillator, the following guidelines should be observed.
  • Keep the trace between the device and the crystal as short as possible.
  • Design a good ground plane around the oscillator pins.
  • Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.
  • Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.
  • Use assembly materials and processes that avoid any parasitic load on the oscillator XIN and XOUT pins.
  • If conformal coating is used, make sure that it does not induce capacitive or resistive leakage between the oscillator pins.
(6) When XT1BYPASS is set, XT1 circuits are automatically powered down. Input signal is a digital square wave with parametrics defined in the Schmitt-trigger inputs section of this data sheet.
(7) Maximum frequency of operation of the entire device cannot be exceeded.
(8) Oscillation allowance is based on a safety factor of 5 for recommended crystals. The oscillation allowance is a function of the XT1DRIVEx settings and the effective load. In general, comparable oscillator allowance can be achieved based on the following guidelines, but should be evaluated based on the actual crystal selected for the application:
  • For XT1DRIVEx = 0, CL,eff ≤ 6 pF.
  • For XT1DRIVEx = 1, 6 pF ≤ CL,eff ≤ 9 pF.
  • For XT1DRIVEx = 2, 6 pF ≤ CL,eff ≤ 10 pF.
  • For XT1DRIVEx = 3, CL,eff ≥ 6 pF.

Table 5-2 lists the characteristics of the VLO.
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