米6体育平台手机版

ZHCSDO6B May 2015 – September 2020 MSP430FG6425 , MSP430FG6426 , MSP430FG6625 , MSP430FG6626

PRODUCTION DATA

封装选项

机械数据 (封装 | 引脚)

PZ|100
- MTQF013A

散热焊盘机械数据 (封装 | 引脚)

PZ|100
- QFND428

订购信息

8.7 Thermal Resistance Characteristics

PARAMETER			VALUE	UNIT
θ_JA	Junction-to-ambient thermal resistance, still air ⁽¹⁾	QFP (PZ)	122	°C/W
θ_JA	Junction-to-ambient thermal resistance, still air ⁽¹⁾	BGA (ZQW)	108	°C/W
θ_JC(TOP)	Junction-to-case (top) thermal resistance ⁽²⁾	QFP (PZ)	83	°C/W
θ_JC(TOP)	Junction-to-case (top) thermal resistance ⁽²⁾	BGA (ZQW)	72	°C/W
θ_JB	Junction-to-board thermal resistance ⁽³⁾	QFP (PZ)	98	°C/W
θ_JB	Junction-to-board thermal resistance ⁽³⁾	BGA (ZQW)	76	°C/W

(1) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as specified in JESD51-7, in an environment described in JESD51-2a.

(2) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(3) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8.