ZHCSDF6F October   2014  – December 2021 MSP430FR4131 , MSP430FR4132 , MSP430FR4133

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 功能方框图
  5. 5 Revision History
  6. 6 Device Comparison
    1. 6.1 Related Products
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagrams
    2. 7.2 Signal Descriptions
    3. 7.3 Pin Multiplexing
    4. 7.4 Connection of Unused Pins
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 8.5  Active Mode Supply Current Per MHz
    6. 8.6  Low-Power Mode LPM0 Supply Currents Into VCC Excluding External Current
    7. 8.7  Low-Power Mode LPM3, LPM4 Supply Currents (Into VCC) Excluding External Current
    8. 8.8  Low-Power Mode LPMx.5 Supply Currents (Into VCC) Excluding External Current
    9. 8.9  Typical Characteristics, Low-Power Mode Supply Currents
    10. 8.10 Current Consumption Per Module
    11. 8.11 Thermal Characteristics
    12. 8.12 Timing and Switching Characteristics
      1. 8.12.1  Power Supply Sequencing
        1. 8.12.1.1 PMM, SVS and BOR
      2. 8.12.2  Reset Timing
        1. 8.12.2.1 Wake-up Times From Low-Power Modes and Reset
      3. 8.12.3  Clock Specifications
        1. 8.12.3.1 XT1 Crystal Oscillator (Low Frequency)
        2. 8.12.3.2 DCO FLL, Frequency
        3. 8.12.3.3 REFO
        4. 8.12.3.4 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        5. 8.12.3.5 Module Oscillator Clock (MODCLK)
      4. 8.12.4  Digital I/Os
        1. 8.12.4.1 Digital Inputs
        2. 8.12.4.2 Digital Outputs
        3. 8.12.4.3 Digital I/O Typical Characteristics
      5. 8.12.5  Timer_A
        1. 8.12.5.1 Timer_A
      6. 8.12.6  eUSCI
        1. 8.12.6.1 eUSCI (UART Mode) Operating Frequency
        2. 8.12.6.2 eUSCI (UART Mode) Switching Characteristics
        3. 8.12.6.3 eUSCI (SPI Master Mode) Operating Frequency
        4. 8.12.6.4 eUSCI (SPI Master Mode) Switching Characteristics
        5. 8.12.6.5 eUSCI (SPI Slave Mode) Switching Characteristics
        6. 8.12.6.6 eUSCI (I2C Mode) Switching Characteristics
      7. 8.12.7  ADC
        1. 8.12.7.1 ADC, Power Supply and Input Range Conditions
        2. 8.12.7.2 ADC, 10-Bit Timing Parameters
        3. 8.12.7.3 ADC, 10-Bit Linearity Parameters
      8. 8.12.8  LCD Controller
        1. 8.12.8.1 LCD Recommended Operating Conditions
      9. 8.12.9  FRAM
        1. 8.12.9.1 FRAM
      10. 8.12.10 Emulation and Debug
        1. 8.12.10.1 JTAG and Spy-Bi-Wire Interface
  9. 9 Detailed Description
    1. 9.1  CPU
    2. 9.2  Operating Modes
    3. 9.3  Interrupt Vector Addresses
    4. 9.4  Bootloader (BSL)
    5. 9.5  JTAG Standard Interface
    6. 9.6  Spy-Bi-Wire Interface (SBW)
    7. 9.7  FRAM
    8. 9.8  Memory Protection
    9. 9.9  Peripherals
      1. 9.9.1  Power Management Module (PMM) and On-Chip Reference Voltages
      2. 9.9.2  Clock System (CS) and Clock Distribution
      3. 9.9.3  General-Purpose Input/Output Port (I/O)
      4. 9.9.4  Watchdog Timer (WDT)
      5. 9.9.5  System Module (SYS)
      6. 9.9.6  Cyclic Redundancy Check (CRC)
      7. 9.9.7  Enhanced Universal Serial Communication Interface (eUSCI_A0, eUSCI_B0)
      8. 9.9.8  Timers (Timer0_A3, Timer1_A3)
      9. 9.9.9  Real-Time Clock (RTC) Counter
      10. 9.9.10 10-Bit Analog Digital Converter (ADC)
      11. 9.9.11 Liquid Crystal Display (LCD)
      12. 9.9.12 Embedded Emulation Module (EEM)
      13. 9.9.13 Input/Output Schematics
        1. 9.9.13.1  Port P1 Input/Output With Schmitt Trigger
        2. 9.9.13.2  Port P2 Input/Output With Schmitt Trigger
        3. 9.9.13.3  Port P3 Input/Output With Schmitt Trigger
        4. 9.9.13.4  Port P4.0 Input/Output With Schmitt Trigger
        5. 9.9.13.5  Port P4.1 and P4.2 Input/Output With Schmitt Trigger
        6. 9.9.13.6  Port 4.3, P4.4, P4.5, P4.6, and P4.7 Input/Output With Schmitt Trigger
        7. 9.9.13.7  Port P5.0, P5.1, P5.2, and P5.3 Input/Output With Schmitt Trigger
        8. 9.9.13.8  Port P5.4, P5.5, P5.6, and P5.7 Input/Output With Schmitt Trigger
        9. 9.9.13.9  Port P6 Input/Output With Schmitt Trigger
        10. 9.9.13.10 Port P7 Input/Output With Schmitt Trigger
        11. 9.9.13.11 Port P8.0 and P8.1 Input/Output With Schmitt Trigger
        12. 9.9.13.12 Port P8.2 and P8.3 Input/Output With Schmitt Trigger
    10. 9.10 Device Descriptors (TLV)
    11. 9.11 Memory
      1. 9.11.1 Peripheral File Map
    12. 9.12 Identification
      1. 9.12.1 Revision Identification
      2. 9.12.2 Device Identification
      3. 9.12.3 JTAG Identification
  10. 10Applications, Implementation, and Layout
    1. 10.1 Device Connection and Layout Fundamentals
      1. 10.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 10.1.2 External Oscillator
      3. 10.1.3 JTAG
      4. 10.1.4 Reset
      5. 10.1.5 Unused Pins
      6. 10.1.6 General Layout Recommendations
      7. 10.1.7 Do's and Don'ts
    2. 10.2 Peripheral- and Interface-Specific Design Information
      1. 10.2.1 ADC Peripheral
        1. 10.2.1.1 Partial Schematic
        2. 10.2.1.2 Design Requirements
        3. 10.2.1.3 Layout Guidelines
      2. 10.2.2 LCD_E Peripheral
        1. 10.2.2.1 Partial Schematic
        2. 10.2.2.2 Design Requirements
        3. 10.2.2.3 Detailed Design Procedure
        4. 10.2.2.4 Layout Guidelines
      3. 10.2.3 Timer
        1. 10.2.3.1 Generate Accurate PWM Using Internal Oscillator
    3. 10.3 Typical Applications
  11. 11Device and Documentation Support
    1. 11.1 Getting Started
    2. 11.2 Device Nomenclature
    3. 11.3 Tools and Software
    4. 11.4 Documentation Support
    5. 11.5 支持资源
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Export Control Notice
    9. 11.9 术语表
  12. 12Mechanical, Packaging, and Orderable Information

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10.2.2.2 Design Requirements

Due to the flexibility of the LCD_E peripheral module to accommodate various segment-based LCDs, selecting the right display for the application in combination with determining specific design requirements is often an iterative process. There can be well-defined requirements in terms of how many individually addressable LCD segments must be controlled, what the requirements for LCD contrast are, which device pins are available for LCD use and which are required by other application functions, and what the power budget is, to name just a few. TI strongly recommends reviewing the LCD_E peripheral module chapter in the MSP430FR4xx and MSP430FR2xx Family User's Guide during the initial design requirements and decision process. Table 10-1 provides a brief overview over different choices that can be made and their impact.

Table 10-1 LCD_E Design Options
OPTION OR FEATUREIMPACT OR USE CASE
Multiplexed LCD
  • Enable displays with more segments
  • Use fewer device pins
  • LCD contrast decreases as mux level increases
  • Power consumption increases with mux level
  • Requires multiple intermediate bias voltages
Static LCD
  • Limited number of segments that can be addressed
  • Use a relatively large number of device pins
  • Use the least amount of power
  • Use only VCC and GND to drive LCD signals
Internal Bias Generation
  • Simpler solution – no external circuitry
  • Independent of VLCD source
  • Somewhat higher power consumption
External Bias Generation
  • Requires external resistor ladder divider
  • Resistor size depends on display
  • Ability to adjust drive strength to optimize tradeoff between power consumption and good drive of large segments (high capacitive load)
  • External resistor ladder divider can be stabilized through capacitors to reduce ripple
Internal Charge Pump
  • Helps ensure a constant level of contrast despite decaying supply voltage conditions (battery-powered applications)
  • Programmable voltage levels allow software-driven contrast control
  • Requires an external capacitor on the LCDCAP pins
  • Higher current consumption than simply using VCC for the LCD driver
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