ZHCSDF6F
October 2014 – December 2021
MSP430FR4131
,
MSP430FR4132
,
MSP430FR4133
PRODUCTION DATA
1
特性
2
应用
3
说明
4
功能方框图
5
Revision History
6
Device Comparison
6.1
Related Products
7
Terminal Configuration and Functions
7.1
Pin Diagrams
7.2
Signal Descriptions
7.3
Pin Multiplexing
7.4
Connection of Unused Pins
8
Specifications
8.1
Absolute Maximum Ratings
8.2
ESD Ratings
8.3
Recommended Operating Conditions
8.4
Active Mode Supply Current Into VCC Excluding External Current
8.5
Active Mode Supply Current Per MHz
8.6
Low-Power Mode LPM0 Supply Currents Into VCC Excluding External Current
8.7
Low-Power Mode LPM3, LPM4 Supply Currents (Into VCC) Excluding External Current
8.8
Low-Power Mode LPMx.5 Supply Currents (Into VCC) Excluding External Current
8.9
Typical Characteristics, Low-Power Mode Supply Currents
8.10
Current Consumption Per Module
8.11
Thermal Characteristics
8.12
Timing and Switching Characteristics
8.12.1
Power Supply Sequencing
8.12.1.1
PMM, SVS and BOR
8.12.2
Reset Timing
8.12.2.1
Wake-up Times From Low-Power Modes and Reset
8.12.3
Clock Specifications
8.12.3.1
XT1 Crystal Oscillator (Low Frequency)
8.12.3.2
DCO FLL, Frequency
8.12.3.3
REFO
8.12.3.4
Internal Very-Low-Power Low-Frequency Oscillator (VLO)
8.12.3.5
Module Oscillator Clock (MODCLK)
8.12.4
Digital I/Os
8.12.4.1
Digital Inputs
8.12.4.2
Digital Outputs
8.12.4.3
Digital I/O Typical Characteristics
8.12.5
Timer_A
8.12.5.1
Timer_A
8.12.6
eUSCI
8.12.6.1
eUSCI (UART Mode) Operating Frequency
8.12.6.2
eUSCI (UART Mode) Switching Characteristics
8.12.6.3
eUSCI (SPI Master Mode) Operating Frequency
8.12.6.4
eUSCI (SPI Master Mode) Switching Characteristics
8.12.6.5
eUSCI (SPI Slave Mode) Switching Characteristics
8.12.6.6
eUSCI (I2C Mode) Switching Characteristics
8.12.7
ADC
8.12.7.1
ADC, Power Supply and Input Range Conditions
8.12.7.2
ADC, 10-Bit Timing Parameters
8.12.7.3
ADC, 10-Bit Linearity Parameters
8.12.8
LCD Controller
8.12.8.1
LCD Recommended Operating Conditions
8.12.9
FRAM
8.12.9.1
FRAM
8.12.10
Emulation and Debug
8.12.10.1
JTAG and Spy-Bi-Wire Interface
9
Detailed Description
9.1
CPU
9.2
Operating Modes
9.3
Interrupt Vector Addresses
9.4
Bootloader (BSL)
9.5
JTAG Standard Interface
9.6
Spy-Bi-Wire Interface (SBW)
9.7
FRAM
9.8
Memory Protection
9.9
Peripherals
9.9.1
Power Management Module (PMM) and On-Chip Reference Voltages
9.9.2
Clock System (CS) and Clock Distribution
9.9.3
General-Purpose Input/Output Port (I/O)
9.9.4
Watchdog Timer (WDT)
9.9.5
System Module (SYS)
9.9.6
Cyclic Redundancy Check (CRC)
9.9.7
Enhanced Universal Serial Communication Interface (eUSCI_A0, eUSCI_B0)
9.9.8
Timers (Timer0_A3, Timer1_A3)
9.9.9
Real-Time Clock (RTC) Counter
9.9.10
10-Bit Analog Digital Converter (ADC)
9.9.11
Liquid Crystal Display (LCD)
9.9.12
Embedded Emulation Module (EEM)
9.9.13
Input/Output Schematics
9.9.13.1
Port P1 Input/Output With Schmitt Trigger
9.9.13.2
Port P2 Input/Output With Schmitt Trigger
9.9.13.3
Port P3 Input/Output With Schmitt Trigger
9.9.13.4
Port P4.0 Input/Output With Schmitt Trigger
9.9.13.5
Port P4.1 and P4.2 Input/Output With Schmitt Trigger
9.9.13.6
Port 4.3, P4.4, P4.5, P4.6, and P4.7 Input/Output With Schmitt Trigger
9.9.13.7
Port P5.0, P5.1, P5.2, and P5.3 Input/Output With Schmitt Trigger
9.9.13.8
Port P5.4, P5.5, P5.6, and P5.7 Input/Output With Schmitt Trigger
9.9.13.9
Port P6 Input/Output With Schmitt Trigger
9.9.13.10
Port P7 Input/Output With Schmitt Trigger
9.9.13.11
Port P8.0 and P8.1 Input/Output With Schmitt Trigger
9.9.13.12
Port P8.2 and P8.3 Input/Output With Schmitt Trigger
9.10
Device Descriptors (TLV)
9.11
Memory
9.11.1
Peripheral File Map
9.12
Identification
9.12.1
Revision Identification
9.12.2
Device Identification
9.12.3
JTAG Identification
10
Applications, Implementation, and Layout
10.1
Device Connection and Layout Fundamentals
10.1.1
Power Supply Decoupling and Bulk Capacitors
10.1.2
External Oscillator
10.1.3
JTAG
10.1.4
Reset
10.1.5
Unused Pins
10.1.6
General Layout Recommendations
10.1.7
Do's and Don'ts
10.2
Peripheral- and Interface-Specific Design Information
10.2.1
ADC Peripheral
10.2.1.1
Partial Schematic
10.2.1.2
Design Requirements
10.2.1.3
Layout Guidelines
10.2.2
LCD_E Peripheral
10.2.2.1
Partial Schematic
10.2.2.2
Design Requirements
10.2.2.3
Detailed Design Procedure
10.2.2.4
Layout Guidelines
10.2.3
Timer
10.2.3.1
Generate Accurate PWM Using Internal Oscillator
10.3
Typical Applications
11
Device and Documentation Support
11.1
Getting Started
11.2
Device Nomenclature
11.3
Tools and Software
11.4
Documentation Support
11.5
支持资源
11.6
Trademarks
11.7
Electrostatic Discharge Caution
11.8
Export Control Notice
11.9
术语表
12
Mechanical, Packaging, and Orderable Information
封装选项
机械数据 (封装 | 引脚)
PM|64
MTQF008B
DGG|48
MPDS583
DGG|56
MPDS570
散热焊盘机械数据 (封装 | 引脚)
订购信息
zhcsdf6f_oa
zhcsdf6f_pm
1
特性
嵌入式微控制器
频率高达 16MHz 的 16 位精简指令集计算机 (RISC) 架构
1.8V 至 3.6V 的宽电源电压范围(最低电源电压受限于 SVS 电平,请参阅
Section 8.12.1.1
)
经优化的低功耗模式(3V)
工作模式:126µA/MHz
待机模式:<1µA,实时时钟 (RTC) 计数器和液晶显示器 (LCD) 处于工作状态
关断 (LPM4.5):15nA
高性能模拟
10 通道 10 位模数转换器 (ADC)
1.5V 的内部基准电压
采样与保持 200ksps
低功耗 LCD 驱动器
支持高达 4×36 段或 8×32 段 LCD 配置
片上电荷泵,在待机模式 (LPM3.5) 下可使 LCD 保持激活状态
每个 LCD 引脚均可通过软件配置为 SEG 或 COM
在 2.6V 至 3.5V 范围内提供对比度控制(阶跃为 0.06V)
低功耗铁电 RAM (FRAM)
容量高达 15.5KB 的非易失性存储器
内置错误修正码 (ECC)
可配置的写保护
对程序、常量和存储的统一存储
耐写次数达 10
15
次
抗辐射和非磁性
智能数字外设
红外调制逻辑
两个 16 位定时器,每个定时器有 3 个捕捉/比较寄存器 (Timer_A3)
一个仅用作计数器的 16 位 RTC 计数器
16 位循环冗余校验器 (CRC)
增强型串行通信
增强型 USCI A (eUSCI_A) 支持 UART、IrDA 和 SPI
增强型 USCI B (eUSCI_B) 支持 SPI 和 I
2
C
时钟系统 (CS)
片上 32kHz RC 振荡器 (REFO)
带有锁频环 (FLL) 的片上 16MHz 数控振荡器 (DCO)
室温下的精度为 ±1%(具有片上基准)
片上超低频 10kHz 振荡器 (VLO)
片上高频调制振荡器时钟 (MODCLK)
外部 32kHz 晶振 (XT1)
可编程 MCLK 预分频器(1 至 128)
通过可编程预分频器(1、2、4 或 8)从 MCLK 获得的 SMCLK
通用输入/输出和引脚功能
60 个 I/O(64 引脚封装)
16 个中断引脚(P1 和 P2)可以将 MCU 从 LPM 唤醒
所有 I/O 均为电容式触摸 I/O
开发工具和软件
开发套件(
MSP-EXP430FR4133
LaunchPad™
开发套件
和
MSP‑TS430PM64D 目标开发板
)
免费软件(
MSP430Ware™
软件
)
系列成员
(另请参阅
Section 6
)
MSP430FR4133:15KB 程序 FRAM + 512B 信息 FRAM + 2KB RAM
MSP430FR4132:8KB 程序 FRAM + 512B 信息 FRAM + 1KB RAM
MSP430FR4131:4KB 程序 FRAM + 512B 信息 FRAM + 512B RAM
封装选项
64 引脚:LQFP (PM)
56 引脚:TSSOP (G56)
48 引脚:TSSOP (G48)
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