米6体育平台手机版

ZHCSCG3C May 2014 – December 2017 MSP430FR5720 , MSP430FR5721 , MSP430FR5722 , MSP430FR5723 , MSP430FR5724 , MSP430FR5725 , MSP430FR5726 , MSP430FR5727 , MSP430FR5728 , MSP430FR5729

PRODUCTION DATA.

封装选项

机械数据 (封装 | 引脚)

DA|38
- MPDS502
RHA|40
- MPQF135D

散热焊盘机械数据 (封装 | 引脚)

DA|38
- QFND327
RHA|40
- QFND027R

订购信息

5.6 Thermal Resistance Characteristics

PARAMETER		PACKAGE	VALUE⁽¹⁾	UNIT
θ_JA	Junction-to-ambient thermal resistance, still air⁽²⁾	TSSOP-24 (PW)	78.8	°C/W
θ_JC(TOP)	Junction-to-case (top) thermal resistance⁽³⁾		19.4	°C/W
θ_JB	Junction-to-board thermal resistance⁽⁵⁾		36.7	°C/W
Ψ_JB	Junction-to-board thermal characterization parameter		36.2	°C/W
Ψ_JT	Junction-to-top thermal characterization parameter		0.5	°C/W
θ_JC(BOTTOM)	Junction-to-case (bottom) thermal resistance⁽⁴⁾		N/A	°C/W
θ_JA	Junction-to-ambient thermal resistance, still air⁽²⁾	QFN-24 (RGE)	42.1	°C/W
θ_JC(TOP)	Junction-to-case (top) thermal resistance⁽³⁾		38.8	°C/W
θ_JB	Junction-to-board thermal resistance⁽⁵⁾		18.1	°C/W
Ψ_JB	Junction-to-board thermal characterization parameter		18.0	°C/W
Ψ_JT	Junction-to-top thermal characterization parameter		0.6	°C/W
θ_JC(BOTTOM)	Junction-to-case (bottom) thermal resistance⁽⁴⁾		2.8	°C/W
θ_JA	Junction-to-ambient thermal resistance, still air⁽²⁾	SOIC-38 (DA)	74.5	°C/W
θ_JC(TOP)	Junction-to-case (top) thermal resistance⁽³⁾		22.0	°C/W
θ_JB	Junction-to-board thermal resistance⁽⁵⁾		40.7	°C/W
Ψ_JB	Junction-to-board thermal characterization parameter		40.3	°C/W
Ψ_JT	Junction-to-top thermal characterization parameter		0.9	°C/W
θ_JC(BOTTOM)	Junction-to-case (bottom) thermal resistance⁽⁴⁾		N/A	°C/W
θ_JA	Junction-to-ambient thermal resistance, still air⁽²⁾	QFN-40 (RHA)	37.8	°C/W
θ_JC(TOP)	Junction-to-case (top) thermal resistance⁽³⁾		27.4	°C/W
θ_JB	Junction-to-board thermal resistance⁽⁵⁾		12.6	°C/W
Ψ_JB	Junction-to-board thermal characterization parameter		12.6	°C/W
Ψ_JT	Junction-to-top thermal characterization parameter		0.4	°C/W
θ_JC(BOTTOM)	Junction-to-case (bottom) thermal resistance⁽⁴⁾		3.6	°C/W

(1) N/A = Not applicable

(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as specified in JESD51-7, in an environment described in JESD51-2a.

(3) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(4) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(5) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8.