ZHCSCI4E May   2014  – August 2018 MSP430FR5847 , MSP430FR58471 , MSP430FR5848 , MSP430FR5849 , MSP430FR5857 , MSP430FR5858 , MSP430FR5859 , MSP430FR5867 , MSP430FR58671 , MSP430FR5868 , MSP430FR5869

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能框图
  2. 2修订历史记录
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Signal Descriptions
      1. Table 4-1 Signal Descriptions
    3. 4.3 Pin Multiplexing
    4. 4.4 Connection of Unused Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Typical Characteristics – Active Mode Supply Currents
    6. 5.6  Low-Power Mode (LPM0, LPM1) Supply Currents Into VCC Excluding External Current
    7. 5.7  Low-Power Mode (LPM2, LPM3, LPM4) Supply Currents (Into VCC) Excluding External Current
    8. 5.8  Low-Power Mode (LPM3.5, LPM4.5) Supply Currents (Into VCC) Excluding External Current
    9. 5.9  Typical Characteristics, Low-Power Mode Supply Currents
    10. 5.10 Typical Characteristics, Current Consumption per Module
    11. 5.11 Thermal Resistance Characteristics
    12. 5.12 Timing and Switching Characteristics
      1. 5.12.1  Power Supply Sequencing
        1. Table 5-1 Brownout and Device Reset Power Ramp Requirements
        2. Table 5-2 SVS
      2. 5.12.2  Reset Timing
        1. Table 5-3 Reset Input
      3. 5.12.3  Clock Specifications
        1. Table 5-4 Low-Frequency Crystal Oscillator, LFXT
        2. Table 5-5 High-Frequency Crystal Oscillator, HFXT
        3. Table 5-6 DCO
        4. Table 5-7 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        5. Table 5-8 Module Oscillator (MODOSC)
      4. 5.12.4  Wake-up Characteristics
        1. Table 5-9  Wake-up Times From Low-Power Modes and Reset
        2. Table 5-10 Typical Wake-up Charge
        3. 5.12.4.1   Typical Characteristics, Average LPM Currents vs Wake-up Frequency
      5. 5.12.5  Digital I/Os
        1. Table 5-11 Digital Inputs
        2. Table 5-12 Digital Outputs
        3. 5.12.5.1   Typical Characteristics, Digital Outputs at 3.0 V and 2.2 V
        4. Table 5-13 Pin-Oscillator Frequency, Ports Px
        5. 5.12.5.2   Typical Characteristics, Pin-Oscillator Frequency
      6. 5.12.6  Timer_A and Timer_B
        1. Table 5-14 Timer_A
        2. Table 5-15 Timer_B
      7. 5.12.7  eUSCI
        1. Table 5-16 eUSCI (UART Mode) Clock Frequency
        2. Table 5-17 eUSCI (UART Mode)
        3. Table 5-18 eUSCI (SPI Master Mode) Clock Frequency
        4. Table 5-19 eUSCI (SPI Master Mode)
        5. Table 5-20 eUSCI (SPI Slave Mode)
        6. Table 5-21 eUSCI (I2C Mode)
      8. 5.12.8  ADC
        1. Table 5-22 12-Bit ADC, Power Supply and Input Range Conditions
        2. Table 5-23 12-Bit ADC, Timing Parameters
        3. Table 5-24 12-Bit ADC, Linearity Parameters With External Reference
        4. Table 5-25 12-Bit ADC, Dynamic Performance for Differential Inputs With External Reference
        5. Table 5-26 12-Bit ADC, Dynamic Performance for Differential Inputs With Internal Reference
        6. Table 5-27 12-Bit ADC, Dynamic Performance for Single-Ended Inputs With External Reference
        7. Table 5-28 12-Bit ADC, Dynamic Performance for Single-Ended Inputs With Internal Reference
        8. Table 5-29 12-Bit ADC, Dynamic Performance With 32.768-kHz Clock
        9. Table 5-30 12-Bit ADC, Temperature Sensor and Built-In V1/2
        10. Table 5-31 12-Bit ADC, External Reference
      9. 5.12.9  Reference
        1. Table 5-32 REF, Built-In Reference
      10. 5.12.10 Comparator
        1. Table 5-33 Comparator_E
      11. 5.12.11 FRAM
        1. Table 5-34 FRAM
    13. 5.13 Emulation and Debug
      1. Table 5-35 JTAG and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  CPU
    3. 6.3  Operating Modes
      1. 6.3.1 Peripherals in Low-Power Modes
        1. 6.3.1.1 Idle Currents of Peripherals in LPM3 and LPM4
    4. 6.4  Interrupt Vector Table and Signatures
    5. 6.5  Memory Organization
    6. 6.6  Bootloader (BSL)
    7. 6.7  JTAG Operation
      1. 6.7.1 JTAG Standard Interface
      2. 6.7.2 Spy-Bi-Wire Interface
    8. 6.8  FRAM
    9. 6.9  Memory Protection Unit Including IP Encapsulation
    10. 6.10 Peripherals
      1. 6.10.1  Digital I/O
      2. 6.10.2  Oscillator and Clock System (CS)
      3. 6.10.3  Power-Management Module (PMM)
      4. 6.10.4  Hardware Multiplier (MPY)
      5. 6.10.5  Real-Time Clock (RTC_B) (Only MSP430FR586x and MSP430FR584x)
      6. 6.10.6  Watchdog Timer (WDT_A)
      7. 6.10.7  System Module (SYS)
      8. 6.10.8  DMA Controller
      9. 6.10.9  Enhanced Universal Serial Communication Interface (eUSCI)
      10. 6.10.10 TA0, TA1
      11. 6.10.11 TA2, TA3
      12. 6.10.12 TB0
      13. 6.10.13 ADC12_B
      14. 6.10.14 Comparator_E
      15. 6.10.15 CRC16
      16. 6.10.16 True Random Seed
      17. 6.10.17 Shared Reference (REF)
      18. 6.10.18 Embedded Emulation
        1. 6.10.18.1 Embedded Emulation Module (EEM)
        2. 6.10.18.2 EnergyTrace++ Technology
      19. 6.10.19 Peripheral File Map
    11. 6.11 Input/Output Diagrams
      1. 6.11.1  Capacitive Touch Functionality Ports P1, P2, P3, P4, and PJ
      2. 6.11.2  Port P1 (P1.0 to P1.2) Input/Output With Schmitt Trigger
      3. 6.11.3  Port P1 (P1.3 to P1.5) Input/Output With Schmitt Trigger
      4. 6.11.4  Port P1 (P1.6 and P1.7) Input/Output With Schmitt Trigger
      5. 6.11.5  Port P2 (P2.0 to P2.2) Input/Output With Schmitt Trigger
      6. 6.11.6  Port P2 (P2.3 and P2.4) Input/Output With Schmitt Trigger
      7. 6.11.7  Port P2 (P2.5 and P2.6) Input/Output With Schmitt Trigger
      8. 6.11.8  Port P2 (P2.7) Input/Output With Schmitt Trigger
      9. 6.11.9  Port P3 (P3.0 to P3.3) Input/Output With Schmitt Trigger
      10. 6.11.10 Port P3 (P3.4 to P3.7) Input/Output With Schmitt Trigger
      11. 6.11.11 Port P4 (P4.0 to P4.3) Input/Output With Schmitt Trigger
      12. 6.11.12 Port P4 (P4.4 to P4.7) Input/Output With Schmitt Trigger
      13. 6.11.13 Port PJ, PJ.4 and PJ.5 Input/Output With Schmitt Trigger
      14. 6.11.14 Port PJ (PJ.6 and PJ.7) Input/Output With Schmitt Trigger
      15. 6.11.15 Port PJ (PJ.0 to PJ.3) JTAG Pins TDO, TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger
    12. 6.12 Device Descriptor (TLV)
    13. 6.13 Identification
      1. 6.13.1 Revision Identification
      2. 6.13.2 Device Identification
      3. 6.13.3 JTAG Identification
  7. 7Applications, Implementation, and Layout
    1. 7.1 Device Connection and Layout Fundamentals
      1. 7.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 7.1.2 External Oscillator
      3. 7.1.3 JTAG
      4. 7.1.4 Reset
      5. 7.1.5 Unused Pins
      6. 7.1.6 General Layout Recommendations
      7. 7.1.7 Do's and Don'ts
    2. 7.2 Peripheral- and Interface-Specific Design Information
      1. 7.2.1 ADC12_B Peripheral
        1. 7.2.1.1 Partial Schematic
        2. 7.2.1.2 Design Requirements
        3. 7.2.1.3 Detailed Design Procedure
        4. 7.2.1.4 Layout Guidelines
  8. 8器件和文档支持
    1. 8.1  入门和后续步骤
    2. 8.2  器件命名规则
    3. 8.3  工具和软件
    4. 8.4  文档支持
    5. 8.5  相关链接
    6. 8.6  社区资源
    7. 8.7  商标
    8. 8.8  静电放电警告
    9. 8.9  出口管制提示
    10. 8.10 术语表
  9. 9机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

1.3 说明

MSP430™超低功耗 (ULP) FRAM 平台将独特的嵌入式 FRAM 和整体超低功耗系统架构组合在一起，从而使得创新人员能够以较少的能源预算增加性能。FRAM 技术以低很多的功耗将 SRAM 的速度、灵活性和耐久性与闪存的稳定性和可靠性组合在一起。

MSP430 ULP FRAM 米6体育平台手机版_好二三四系列包含一组采用 FRAM 的多种器件、ULP 16 位 MSP430 CPU 以及适用于各种 应用的智能外设。ULP 架构特有 7 种低功耗模式，针对在能量受限应用中延长电池使用寿命进行了 优化。

器件信息(1)

器件型号 封装 封装尺寸(2)
MSP430FR5869IRGZ VQFN (48) 7mm x 7mm
MSP430FR5859IRHA VQFN (40) 6mm × 6mm
MSP430FR5859IDA TSSOP (38) 12.5mm x 6.2mm
(1) 要获得所有可用器件的最新部件、封装和订购信息，请参见封装选项附录（Section 9）或浏览 TI 网站 www.yogichopra.com。
(2) 这里显示的尺寸为近似值。要获得包含误差值的封装尺寸，请参见机械数据（Section 9）。
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