ZHCSF37C March   2016  – August 2018 MSP430FR5962 , MSP430FR5964 , MSP430FR5992 , MSP430FR5994 , MSP430FR59941

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能框图
  2. 2修订历史记录
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Pin Attributes
    3. 4.3 Signal Descriptions
      1. Table 4-2 Signal Descriptions
    4. 4.4 Pin Multiplexing
    5. 4.5 Buffer Types
    6. 4.6 Connection of Unused Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Typical Characteristics, Active Mode Supply Currents
    6. 5.6  Low-Power Mode (LPM0, LPM1) Supply Currents Into VCC Excluding External Current
    7. 5.7  Low-Power Mode (LPM2, LPM3, LPM4) Supply Currents (Into VCC) Excluding External Current
    8. 5.8  Low-Power Mode (LPMx.5) Supply Currents (Into VCC) Excluding External Current
    9. 5.9  Typical Characteristics, Low-Power Mode Supply Currents
    10. 5.10 Typical Characteristics, Current Consumption per Module
    11. 5.11 Thermal Packaging Characteristics
    12. 5.12 Timing and Switching Characteristics
      1. 5.12.1  Power Supply Sequencing
        1. Table 5-1 Brownout and Device Reset Power Ramp Requirements
        2. Table 5-2 SVS
      2. 5.12.2  Reset Timing
        1. Table 5-3 Reset Input
      3. 5.12.3  Clock Specifications
        1. Table 5-4 Low-Frequency Crystal Oscillator, LFXT
        2. Table 5-5 High-Frequency Crystal Oscillator, HFXT
        3. Table 5-6 DCO
        4. Table 5-7 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        5. Table 5-8 Module Oscillator (MODOSC)
      4. 5.12.4  Wake-up Characteristics
        1. Table 5-9  Wake-up Times From Low-Power Modes and Reset
        2. 5.12.4.1   Typical Characteristics, Average LPM Currents vs Wake-up Frequency
        3. Table 5-10 Typical Wake-up Charge
      5. 5.12.5  Digital I/Os
        1. Table 5-11 Digital Inputs
        2. Table 5-12 Digital Outputs
        3. 5.12.5.1   Typical Characteristics, Digital Outputs at 3.0 V and 2.2 V
        4. Table 5-13 Pin-Oscillator Frequency, Ports Px
        5. 5.12.5.2   Typical Characteristics, Pin-Oscillator Frequency
      6. 5.12.6  LEA (Low-Energy Accelerator) (MSP430FR599x Only)
        1. Table 5-14 Low Energy Accelerator Performance
      7. 5.12.7  Timer_A and Timer_B
        1. Table 5-15 Timer_A
        2. Table 5-16 Timer_B
      8. 5.12.8  eUSCI
        1. Table 5-17 eUSCI (UART Mode) Clock Frequency
        2. Table 5-18 eUSCI (UART Mode)
        3. Table 5-19 eUSCI (SPI Master Mode) Clock Frequency
        4. Table 5-20 eUSCI (SPI Master Mode)
        5. Table 5-21 eUSCI (SPI Slave Mode)
        6. Table 5-22 eUSCI (I2C Mode)
      9. 5.12.9  ADC12_B
        1. Table 5-23 12-Bit ADC, Power Supply and Input Range Conditions
        2. Table 5-24 12-Bit ADC, Timing Parameters
        3. Table 5-25 12-Bit ADC, Linearity Parameters
        4. Table 5-26 12-Bit ADC, Dynamic Performance With External Reference
        5. Table 5-27 12-Bit ADC, Dynamic Performance With Internal Reference
        6. Table 5-28 12-Bit ADC, Temperature Sensor and Built-In V1/2
        7. Table 5-29 12-Bit ADC, External Reference
      10. 5.12.10 Reference
        1. Table 5-30 REF, Built-In Reference
      11. 5.12.11 Comparator
        1. Table 5-31 Comparator_E
      12. 5.12.12 FRAM
        1. Table 5-32 FRAM
      13. 5.12.13 Emulation and Debug
        1. Table 5-33 JTAG and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  CPU
    3. 6.3  Low-Energy Accelerator (LEA) for Signal Processing (MSP430FR599x Only)
    4. 6.4  Operating Modes
      1. 6.4.1 Peripherals in Low-Power Modes
      2. 6.4.2 Idle Currents of Peripherals in LPM3 and LPM4
    5. 6.5  Interrupt Vector Table and Signatures
    6. 6.6  Bootloader (BSL)
    7. 6.7  JTAG Operation
      1. 6.7.1 JTAG Standard Interface
      2. 6.7.2 Spy-Bi-Wire Interface
    8. 6.8  FRAM Controller A (FRCTL_A)
    9. 6.9  RAM
    10. 6.10 Tiny RAM
    11. 6.11 Memory Protection Unit (MPU) Including IP Encapsulation
    12. 6.12 Peripherals
      1. 6.12.1  Digital I/O
      2. 6.12.2  Oscillator and Clock System (CS)
      3. 6.12.3  Power-Management Module (PMM)
      4. 6.12.4  Hardware Multiplier (MPY)
      5. 6.12.5  Real-Time Clock (RTC_C)
      6. 6.12.6  Watchdog Timer (WDT_A)
      7. 6.12.7  System Module (SYS)
      8. 6.12.8  DMA Controller
      9. 6.12.9  Enhanced Universal Serial Communication Interface (eUSCI)
      10. 6.12.10 TA0, TA1, and TA4
      11. 6.12.11 TA2 and TA3
      12. 6.12.12 TB0
      13. 6.12.13 ADC12_B
      14. 6.12.14 Comparator_E
      15. 6.12.15 CRC16
      16. 6.12.16 CRC32
      17. 6.12.17 AES256 Accelerator
      18. 6.12.18 True Random Seed
      19. 6.12.19 Shared Reference (REF)
      20. 6.12.20 Embedded Emulation
        1. 6.12.20.1 Embedded Emulation Module (EEM) (S Version)
        2. 6.12.20.2 EnergyTrace++ Technology
    13. 6.13 Input/Output Diagrams
      1. 6.13.1  Capacitive Touch Functionality on Ports P1 to P8, and PJ
      2. 6.13.2  Port P1 (P1.0 to P1.2) Input/Output With Schmitt Trigger
      3. 6.13.3  Port P1 (P1.3 to P1.5) Input/Output With Schmitt Trigger
      4. 6.13.4  Port P1 (P1.6 and P1.7) Input/Output With Schmitt Trigger
      5. 6.13.5  Port P2 (P2.0 to P2.2) Input/Output With Schmitt Trigger
      6. 6.13.6  Port P2 (P2.3 and P2.4) Input/Output With Schmitt Trigger
      7. 6.13.7  Port P2 (P2.5 and P2.6) Input/Output With Schmitt Trigger
      8. 6.13.8  Port P2 (P2.7) Input/Output With Schmitt Trigger
      9. 6.13.9  Port P3 (P3.0 to P3.3) Input/Output With Schmitt Trigger
      10. 6.13.10 Port P3 (P3.4 to P3.7) Input/Output With Schmitt Trigger
      11. 6.13.11 Port P4 (P4.0 to P4.3) Input/Output With Schmitt Trigger
      12. 6.13.12 Port P4 (P4.4 to P4.7) Input/Output With Schmitt Trigger
      13. 6.13.13 Port P5 (P5.0 to P5.7) Input/Output With Schmitt Trigger
      14. 6.13.14 Port P6 (P6.0 to P6.7) Input/Output With Schmitt Trigger
      15. 6.13.15 Port P7 (P7.0 to P7.3) Input/Output With Schmitt Trigger
      16. 6.13.16 Port P7 (P7.4 to P7.7) Input/Output With Schmitt Trigger
      17. 6.13.17 Port P8 (P8.0 to P8.3) Input/Output With Schmitt Trigger
      18. 6.13.18 Port PJ (PJ.4 and PJ.5) Input/Output With Schmitt Trigger
      19. 6.13.19 Port PJ (PJ.6 and PJ.7) Input/Output With Schmitt Trigger
      20. 6.13.20 Port PJ (PJ.0 to PJ.3) JTAG Pins TDO, TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger
    14. 6.14 Device Descriptors (TLV)
    15. 6.15 Memory Map
      1. 6.15.1 Peripheral File Map
    16. 6.16 Identification
      1. 6.16.1 Revision Identification
      2. 6.16.2 Device Identification
      3. 6.16.3 JTAG Identification
  7. 7Applications, Implementation, and Layout
    1. 7.1 Device Connection and Layout Fundamentals
      1. 7.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 7.1.2 External Oscillator
      3. 7.1.3 JTAG
      4. 7.1.4 Reset
      5. 7.1.5 Unused Pins
      6. 7.1.6 General Layout Recommendations
      7. 7.1.7 Do's and Don'ts
    2. 7.2 Peripheral- and Interface-Specific Design Information
      1. 7.2.1 ADC12_B Peripheral
        1. 7.2.1.1 Partial Schematic
        2. 7.2.1.2 Design Requirements
        3. 7.2.1.3 Detailed Design Procedure
        4. 7.2.1.4 Layout Guidelines
  8. 8器件和文档支持
    1. 8.1  入门和下一步
    2. 8.2  器件命名规则
    3. 8.3  工具与软件
    4. 8.4  文档支持
    5. 8.5  相关链接
    6. 8.6  社区资源
    7. 8.7  商标
    8. 8.8  静电放电警告
    9. 8.9  出口管制提示
    10. 8.10 术语表
  9. 9机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

8.4 文档支持

以下文档介绍 MSP430FR599x 和 MSP430FR596x MCU。www.yogichopra.com 网站上提供了这些文档的副本。

接收文档更新通知

要接收文档更新通知（包括芯片勘误表），请转至 ti.com.cn 上您的器件对应的米6体育平台手机版_好二三四文件夹（关于米6体育平台手机版_好二三四文件夹的链接，请参见Section 8.5）。请单击右上角的“通知我”按钮。点击注册后，即可收到米6体育平台手机版_好二三四信息更改每周摘要（如有）。有关更改的详细信息，请查阅已修订文档的修订历史记录。

勘误

用户指南

    《通过 JTAG 接口对 MSP430 进行编程》

    此文档介绍了使用 JTAG 通信端口擦除、编程和验证基于 MSP430 闪存和 FRAM 的微控制器系列的存储器模块所需的功能。此外，该文档还介绍了如何编程所有 MSP430 器件上均具备的 JTAG 访问安全保险丝。此文档介绍了使用标准四线制 JTAG 接口和两线制 JTAG 接口（也称为 Spy-Bi-Wire (SBW)）的器件访问。

    《MSP430 硬件工具用户指南》

    此手册介绍了 TI MSP-FET430 闪存仿真工具 (FET) 的硬件。FET 是针对 MSP430 超低功耗微控制器的程序开发工具。文中对提供的接口类型，即并行端口接口和 USB 接口进行了说明。

应用报告

    《MSP430 32kHz 晶体振荡器》

    选择合适的晶体、正确的负载电路和适当的电路板布局是实现稳定的晶体振荡器的关键。该应用报告总结了晶体振荡器的功能，介绍了用于选择合适的晶体以实现 MSP430 超低功耗运行的参数。此外，还给出了正确电路板布局的提示和示例。此外，为了确保振荡器在大规模生产后能够稳定运行，还可能需要进行一些振荡器测试，该文档中提供了有关这些测试的详细信息。

    《MSP430 系统级 ESD 注意事项》

    随着硅晶技术向更低电压方向发展以及设计具有成本效益的超低功耗组件的需求的出现，系统级 ESD 要求变得越来越苛刻。本应用报告解决了三大不同的 ESD 主题，帮助电路板设计人员和 OEM 了解并设计强大的系统级设计：(1) 组件级 ESD 测试和系统级 ESD 测试；(2) 实现不同水平的系统级 ESD 保护的通用设计指南；(3) 系统高效 ESD 设计 (SEED) 简介。
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