ZHCSF37C March   2016  – August 2018 MSP430FR5962 , MSP430FR5964 , MSP430FR5992 , MSP430FR5994 , MSP430FR59941

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能框图
  2. 2修订历史记录
  3. 3Device Comparison
    1. 3.1 Related Products
  4. 4Terminal Configuration and Functions
    1. 4.1 Pin Diagrams
    2. 4.2 Pin Attributes
    3. 4.3 Signal Descriptions
      1. Table 4-2 Signal Descriptions
    4. 4.4 Pin Multiplexing
    5. 4.5 Buffer Types
    6. 4.6 Connection of Unused Pins
  5. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Active Mode Supply Current Into VCC Excluding External Current
    5. 5.5  Typical Characteristics, Active Mode Supply Currents
    6. 5.6  Low-Power Mode (LPM0, LPM1) Supply Currents Into VCC Excluding External Current
    7. 5.7  Low-Power Mode (LPM2, LPM3, LPM4) Supply Currents (Into VCC) Excluding External Current
    8. 5.8  Low-Power Mode (LPMx.5) Supply Currents (Into VCC) Excluding External Current
    9. 5.9  Typical Characteristics, Low-Power Mode Supply Currents
    10. 5.10 Typical Characteristics, Current Consumption per Module
    11. 5.11 Thermal Packaging Characteristics
    12. 5.12 Timing and Switching Characteristics
      1. 5.12.1  Power Supply Sequencing
        1. Table 5-1 Brownout and Device Reset Power Ramp Requirements
        2. Table 5-2 SVS
      2. 5.12.2  Reset Timing
        1. Table 5-3 Reset Input
      3. 5.12.3  Clock Specifications
        1. Table 5-4 Low-Frequency Crystal Oscillator, LFXT
        2. Table 5-5 High-Frequency Crystal Oscillator, HFXT
        3. Table 5-6 DCO
        4. Table 5-7 Internal Very-Low-Power Low-Frequency Oscillator (VLO)
        5. Table 5-8 Module Oscillator (MODOSC)
      4. 5.12.4  Wake-up Characteristics
        1. Table 5-9  Wake-up Times From Low-Power Modes and Reset
        2. 5.12.4.1   Typical Characteristics, Average LPM Currents vs Wake-up Frequency
        3. Table 5-10 Typical Wake-up Charge
      5. 5.12.5  Digital I/Os
        1. Table 5-11 Digital Inputs
        2. Table 5-12 Digital Outputs
        3. 5.12.5.1   Typical Characteristics, Digital Outputs at 3.0 V and 2.2 V
        4. Table 5-13 Pin-Oscillator Frequency, Ports Px
        5. 5.12.5.2   Typical Characteristics, Pin-Oscillator Frequency
      6. 5.12.6  LEA (Low-Energy Accelerator) (MSP430FR599x Only)
        1. Table 5-14 Low Energy Accelerator Performance
      7. 5.12.7  Timer_A and Timer_B
        1. Table 5-15 Timer_A
        2. Table 5-16 Timer_B
      8. 5.12.8  eUSCI
        1. Table 5-17 eUSCI (UART Mode) Clock Frequency
        2. Table 5-18 eUSCI (UART Mode)
        3. Table 5-19 eUSCI (SPI Master Mode) Clock Frequency
        4. Table 5-20 eUSCI (SPI Master Mode)
        5. Table 5-21 eUSCI (SPI Slave Mode)
        6. Table 5-22 eUSCI (I2C Mode)
      9. 5.12.9  ADC12_B
        1. Table 5-23 12-Bit ADC, Power Supply and Input Range Conditions
        2. Table 5-24 12-Bit ADC, Timing Parameters
        3. Table 5-25 12-Bit ADC, Linearity Parameters
        4. Table 5-26 12-Bit ADC, Dynamic Performance With External Reference
        5. Table 5-27 12-Bit ADC, Dynamic Performance With Internal Reference
        6. Table 5-28 12-Bit ADC, Temperature Sensor and Built-In V1/2
        7. Table 5-29 12-Bit ADC, External Reference
      10. 5.12.10 Reference
        1. Table 5-30 REF, Built-In Reference
      11. 5.12.11 Comparator
        1. Table 5-31 Comparator_E
      12. 5.12.12 FRAM
        1. Table 5-32 FRAM
      13. 5.12.13 Emulation and Debug
        1. Table 5-33 JTAG and Spy-Bi-Wire Interface
  6. 6Detailed Description
    1. 6.1  Overview
    2. 6.2  CPU
    3. 6.3  Low-Energy Accelerator (LEA) for Signal Processing (MSP430FR599x Only)
    4. 6.4  Operating Modes
      1. 6.4.1 Peripherals in Low-Power Modes
      2. 6.4.2 Idle Currents of Peripherals in LPM3 and LPM4
    5. 6.5  Interrupt Vector Table and Signatures
    6. 6.6  Bootloader (BSL)
    7. 6.7  JTAG Operation
      1. 6.7.1 JTAG Standard Interface
      2. 6.7.2 Spy-Bi-Wire Interface
    8. 6.8  FRAM Controller A (FRCTL_A)
    9. 6.9  RAM
    10. 6.10 Tiny RAM
    11. 6.11 Memory Protection Unit (MPU) Including IP Encapsulation
    12. 6.12 Peripherals
      1. 6.12.1  Digital I/O
      2. 6.12.2  Oscillator and Clock System (CS)
      3. 6.12.3  Power-Management Module (PMM)
      4. 6.12.4  Hardware Multiplier (MPY)
      5. 6.12.5  Real-Time Clock (RTC_C)
      6. 6.12.6  Watchdog Timer (WDT_A)
      7. 6.12.7  System Module (SYS)
      8. 6.12.8  DMA Controller
      9. 6.12.9  Enhanced Universal Serial Communication Interface (eUSCI)
      10. 6.12.10 TA0, TA1, and TA4
      11. 6.12.11 TA2 and TA3
      12. 6.12.12 TB0
      13. 6.12.13 ADC12_B
      14. 6.12.14 Comparator_E
      15. 6.12.15 CRC16
      16. 6.12.16 CRC32
      17. 6.12.17 AES256 Accelerator
      18. 6.12.18 True Random Seed
      19. 6.12.19 Shared Reference (REF)
      20. 6.12.20 Embedded Emulation
        1. 6.12.20.1 Embedded Emulation Module (EEM) (S Version)
        2. 6.12.20.2 EnergyTrace++ Technology
    13. 6.13 Input/Output Diagrams
      1. 6.13.1  Capacitive Touch Functionality on Ports P1 to P8, and PJ
      2. 6.13.2  Port P1 (P1.0 to P1.2) Input/Output With Schmitt Trigger
      3. 6.13.3  Port P1 (P1.3 to P1.5) Input/Output With Schmitt Trigger
      4. 6.13.4  Port P1 (P1.6 and P1.7) Input/Output With Schmitt Trigger
      5. 6.13.5  Port P2 (P2.0 to P2.2) Input/Output With Schmitt Trigger
      6. 6.13.6  Port P2 (P2.3 and P2.4) Input/Output With Schmitt Trigger
      7. 6.13.7  Port P2 (P2.5 and P2.6) Input/Output With Schmitt Trigger
      8. 6.13.8  Port P2 (P2.7) Input/Output With Schmitt Trigger
      9. 6.13.9  Port P3 (P3.0 to P3.3) Input/Output With Schmitt Trigger
      10. 6.13.10 Port P3 (P3.4 to P3.7) Input/Output With Schmitt Trigger
      11. 6.13.11 Port P4 (P4.0 to P4.3) Input/Output With Schmitt Trigger
      12. 6.13.12 Port P4 (P4.4 to P4.7) Input/Output With Schmitt Trigger
      13. 6.13.13 Port P5 (P5.0 to P5.7) Input/Output With Schmitt Trigger
      14. 6.13.14 Port P6 (P6.0 to P6.7) Input/Output With Schmitt Trigger
      15. 6.13.15 Port P7 (P7.0 to P7.3) Input/Output With Schmitt Trigger
      16. 6.13.16 Port P7 (P7.4 to P7.7) Input/Output With Schmitt Trigger
      17. 6.13.17 Port P8 (P8.0 to P8.3) Input/Output With Schmitt Trigger
      18. 6.13.18 Port PJ (PJ.4 and PJ.5) Input/Output With Schmitt Trigger
      19. 6.13.19 Port PJ (PJ.6 and PJ.7) Input/Output With Schmitt Trigger
      20. 6.13.20 Port PJ (PJ.0 to PJ.3) JTAG Pins TDO, TMS, TCK, TDI/TCLK, Input/Output With Schmitt Trigger
    14. 6.14 Device Descriptors (TLV)
    15. 6.15 Memory Map
      1. 6.15.1 Peripheral File Map
    16. 6.16 Identification
      1. 6.16.1 Revision Identification
      2. 6.16.2 Device Identification
      3. 6.16.3 JTAG Identification
  7. 7Applications, Implementation, and Layout
    1. 7.1 Device Connection and Layout Fundamentals
      1. 7.1.1 Power Supply Decoupling and Bulk Capacitors
      2. 7.1.2 External Oscillator
      3. 7.1.3 JTAG
      4. 7.1.4 Reset
      5. 7.1.5 Unused Pins
      6. 7.1.6 General Layout Recommendations
      7. 7.1.7 Do's and Don'ts
    2. 7.2 Peripheral- and Interface-Specific Design Information
      1. 7.2.1 ADC12_B Peripheral
        1. 7.2.1.1 Partial Schematic
        2. 7.2.1.2 Design Requirements
        3. 7.2.1.3 Detailed Design Procedure
        4. 7.2.1.4 Layout Guidelines
  8. 8器件和文档支持
    1. 8.1  入门和下一步
    2. 8.2  器件命名规则
    3. 8.3  工具与软件
    4. 8.4  文档支持
    5. 8.5  相关链接
    6. 8.6  社区资源
    7. 8.7  商标
    8. 8.8  静电放电警告
    9. 8.9  出口管制提示
    10. 8.10 术语表
  9. 9机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Active Mode Supply Current Into VCC Excluding External Current

over recommended operating free-air temperature (unless otherwise noted)(1)(2) (see Figure 5-1)
PARAMETER EXECUTION MEMORY VCC FREQUENCY (fMCLK = fSMCLK) UNIT
1 MHz
0 WAIT STATES
(NWAITSx = 0)		 4 MHz
0 WAIT STATES
(NWAITSx = 0)		 8 MHz
0 WAIT STATES
(NWAITSx = 0)		 12 MHz
1 WAIT STATE
(NWAITSx = 1)		 16 MHz
1 WAIT STATE
(NWAITSx = 1)
TYP MAX TYP MAX TYP MAX TYP MAX TYP MAX
IAM, FRAM_UNI
(Unified memory)(3) 		FRAM 3.0 V 225 665 1275 1550 1970 µA
IAM, FRAM(0%)(4)(5) FRAM
0% cache hit ratio		 3.0 V 420 1455 2850 2330 3000 µA
IAM, FRAM(50%)(4)(5) FRAM
50% cache hit ratio		 3.0 V 275 855 1650 1770 2265 µA
IAM, FRAM(66%)(4)(5) FRAM
66% cache hit ratio		 3.0 V 220 650 1240 1490 1880 µA
IAM, FRAM(75%)(4)(5) FRAM
75% cache hit ratio		 3.0 V 192 261 535 1015 1170 1290 1490 1620 1870 µA
IAM, FRAM(100%(4)(5) FRAM
100% cache hit ratio		 3.0 V 125 255 450 670 790 µA
IAM, RAM(6)(5) RAM 3.0 V 140 325 590 880 1070 µA
IAM, RAM only(7)(5) RAM 3.0 V 90 182 280 540 830 1020 1313 µA
(1) All inputs are tied to 0 V or to VCC. Outputs do not source or sink any current.
(2) Characterized with program executing typical data processing.
fACLK = 32768 Hz, fMCLK = fSMCLK = fDCO at specified frequency, except for 12 MHz. For 12 MHz, fDCO= 24 MHz and fMCLK = fSMCLK = fDCO / 2.
At MCLK frequencies above 8 MHz, the FRAM requires wait states. When wait states are required, the effective MCLK frequency (fMCLK,eff) decreases. The effective MCLK frequency also depends on the cache hit ratio. SMCLK is not affected by the number of wait states or the cache hit ratio.
The following equation can be used to compute fMCLK,eff:
fMCLK,eff = fMCLK / [wait states × (1 – cache hit ratio) + 1]
For example, with 1 wait state and 75% cache hit ratio fMCKL,eff = fMCLK / [1 × (1 – 0.75) + 1] = fMCLK / 1.25.
(3) Represents typical program execution. Program and data reside entirely in FRAM. All execution is from FRAM.
(4) Program resides in FRAM. Data resides in SRAM. Average current dissipation varies with cache hit-to-miss ratio as specified. Cache hit ratio represents number cache accesess divided by the total number of FRAM accesses. For example, a 75% ratio implies three of every four accesses is from cache, and the remaining are FRAM accesses.
(5) See Figure 5-1 for typical curves. The characteristic equation shown in the graph is computed using the least squares method for best linear fit using the typical data shown in Section 5.4.
(6) Program and data reside entirely in RAM. All execution is from RAM.
(7) Program and data reside entirely in RAM. All execution is from RAM. FRAM is off.
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