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ZHCSJA6B January 2019 – December 2021 MSP430FR5041 , MSP430FR5043 , MSP430FR50431 , MSP430FR6041 , MSP430FR6043 , MSP430FR60431

PRODUCTION DATA

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机械数据 (封装 | 引脚)

PN|80
- MTQF010B

散热焊盘机械数据 (封装 | 引脚)

订购信息

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾

	MIN	MAX	UNIT
Voltage applied at DVCC and AVCC pins to V_SS	–0.3	4.1	V
Voltage applied at DVCC, AVCC, and PVCC pins to V_SS	–0.3	4.1	V
Voltage difference between DVCC and AVCC pins⁽²⁾		±0.3	V
Voltage difference between DVCC, AVCC, and PVCC pins⁽²⁾		±0.3	V
Voltage applied to CHx_IN	–0.3	1.65	V
Voltage applied to CHx_IN (duty cycle of 10% over 1ms)	–0.3	1.8	V
Voltage applied to USSXTIN (USSXTOUT)	–0.3	1.5	V
Voltage applied to any other pin ⁽³⁾	–0.3	V_CC + 0.3 V (4.1 V Max)	V
Diode current at any device pin		±2	mA
Storage temperature, T_stg⁽⁴⁾	–40	125	°C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) Voltage differences between DVCC and AVCC exceeding the specified limits may cause malfunction of the device including erroneous writes to RAM and FRAM.

(3) All voltages referenced to V_SS.

(4) Higher temperature may be applied during board soldering according to the current JEDEC J-STD-020 specification with peak reflow temperatures not higher than classified on the device label on the shipping boxes or reels.