米6体育平台手机版

ZHCSCU9C August 2014 – August 2018 MSP430FR5887 , MSP430FR5888 , MSP430FR5889 , MSP430FR58891 , MSP430FR6887 , MSP430FR6888 , MSP430FR6889 , MSP430FR68891

PRODUCTION DATA.

封装选项

机械数据 (封装 | 引脚)

PN|80
- MTQF010B
PZ|100
- MTQF013A

散热焊盘机械数据 (封装 | 引脚)

PZ|100
- QFND428

订购信息

5.12 Thermal Resistance Characteristics

THERMAL METRIC⁽¹⁾		PACKAGE	VALUE⁽²⁾	UNIT
θ_JA	Junction-to-ambient thermal resistance, still air⁽³⁾	LQFP-100 (PZ)	49.8	°C/W
θ_JC(TOP)	Junction-to-case (top) thermal resistance⁽⁴⁾		9.7	°C/W
θ_JB	Junction-to-board thermal resistance⁽⁶⁾		26.0	°C/W
Ψ_JB	Junction-to-board thermal characterization parameter		25.7	°C/W
Ψ_JT	Junction-to-top thermal characterization parameter		0.2	°C/W
θ_JC(BOTTOM)	Junction-to-case (bottom) thermal resistance⁽⁵⁾		N/A	°C/W
θ_JA	Junction-to-ambient thermal resistance, still air⁽³⁾	LQFP-80 (PN)	49.5	°C/W
θ_JC(TOP)	Junction-to-case (top) thermal resistance⁽⁴⁾		14.7	°C/W
θ_JB	Junction-to-board thermal resistance⁽⁶⁾		24.1	°C/W
Ψ_JB	Junction-to-board thermal characterization parameter		23.8	°C/W
Ψ_JT	Junction-to-top thermal characterization parameter		0.7	°C/W
θ_JC(BOTTOM)	Junction-to-case (bottom) thermal resistance⁽⁵⁾		N/A	°C/W
θ_JA	Junction-to-ambient thermal resistance, still air⁽³⁾	LQFP-64 (PM)	55.3	°C/W
θ_JC(TOP)	Junction-to-case (top) thermal resistance⁽⁴⁾		16.8	°C/W
θ_JB	Junction-to-board thermal resistance⁽⁶⁾		26.8	°C/W
Ψ_JB	Junction-to-board thermal characterization parameter		26.5	°C/W
Ψ_JT	Junction-to-top thermal characterization parameter		0.8	°C/W
θ_JC(BOTTOM)	Junction-to-case (bottom) thermal resistance⁽⁵⁾		N/A	°C/W
θ_JA	Junction-to-ambient thermal resistance, still air⁽³⁾	VQFN-64 (RGC)	29.2	°C/W
θ_JC(TOP)	Junction-to-case (top) thermal resistance⁽⁴⁾		13.9	°C/W
θ_JB	Junction-to-board thermal resistance⁽⁶⁾		8.1	°C/W
Ψ_JB	Junction-to-board thermal characterization parameter		8.0	°C/W
Ψ_JT	Junction-to-top thermal characterization parameter		0.2	°C/W
θ_JC(BOTTOM)	Junction-to-case (bottom) thermal resistance⁽⁵⁾		1.0	°C/W

(1) For more information about traditional and new thermal metrics, see Semiconductor and IC Package Thermal Metrics.

(2) N/A = not applicable

(3) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as specified in JESD51-7, in an environment described in JESD51-2a.

(4) The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(5) The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.

(6) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB temperature, as described in JESD51-8.