米6体育平台手机版

ZHCSEI0D January 2016 – Feburary 2019 MUX36D04 , MUX36S08

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		MUX36S08 and MUX36D04			UNIT
		PW (TSSOP)	RUM (WQFN)	RRJ (WQFN)
		16 PINS	16 PINS	16 PINS
R_θJA	Junction-to-ambient thermal resistance	103.8	37.3	46.2	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	36.8	31.6	37.7	°C/W
R_θJB	Junction-to-board thermal resistance	49.8	16.2	21.7	°C/W
ψ_JT	Junction-to-top characterization parameter	2.7	0.5	0.7	°C/W
ψ_JB	Junction-to-board characterization parameter	49.1	16.2	21.7	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	6.1	6.2	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.