ZHCSFU9A November   2016  – November 2017 MUX506 , MUX507

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      简化电路原理图
      2.      泄漏电流与温度间的关系
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions: MUX506
    2.     Pin Functions: MUX507
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: Dual Supply
    6. 6.6 Electrical Characteristics: Single Supply
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1  Truth Tables
    2. 7.2  On-Resistance
    3. 7.3  Off Leakage
    4. 7.4  On-Leakage Current
    5. 7.5  Transition Time
    6. 7.6  Break-Before-Make Delay
    7. 7.7  Turn-On and Turn-Off Time
    8. 7.8  Charge Injection
    9. 7.9  Off Isolation
    10. 7.10 Channel-to-Channel Crosstalk
    11. 7.11 Bandwidth
    12. 7.12 THD + Noise
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Ultralow Leakage Current
      2. 8.3.2 Ultralow Charge Injection
      3. 8.3.3 Bidirectional Operation
      4. 8.3.4 Rail-to-Rail Operation
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 相关链接
    3. 12.3 接收文档更新通知
    4. 12.4 社区资源
    5. 12.5 商标
    6. 12.6 静电放电警告
    7. 12.7 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information

THERMAL METRIC(1)MUX50xUNIT
PW (TSSOP)DW (SOIC)
28 PINS28 PINS
RθJA Junction-to-ambient thermal resistance 79.8 53.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 24.0 30.1 °C/W
RθJB Junction-to-board thermal resistance 37.6 28.5 °C/W
ψJT Junction-to-top characterization parameter 1.2 9.0 °C/W
ψJB Junction-to-board characterization parameter 37.1 28.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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