ZHCS399E August   2011  – January 2017 OMAP-L132

PRODUCTION DATA.  

  1. 1器件概述
    1. 1.1 特性
    2. 1.2 应用
    3. 1.3 说明
    4. 1.4 功能方框图
  2. 2Revision History
  3. 3Device Comparison
    1. 3.1 Device Characteristics
    2. 3.2 Device Compatibility
    3. 3.3 ARM Subsystem
      1. 3.3.1 ARM926EJ-S RISC CPU
      2. 3.3.2 CP15
      3. 3.3.3 MMU
      4. 3.3.4 Caches and Write Buffer
      5. 3.3.5 Advanced High-Performance Bus (AHB)
      6. 3.3.6 Embedded Trace Macrocell (ETM) and Embedded Trace Buffer (ETB)
      7. 3.3.7 ARM Memory Mapping
    4. 3.4 DSP Subsystem
      1. 3.4.1 C674x DSP CPU Description
      2. 3.4.2 DSP Memory Mapping
        1. 3.4.2.1 ARM Internal Memories
        2. 3.4.2.2 External Memories
        3. 3.4.2.3 DSP Internal Memories
        4. 3.4.2.4 C674x CPU
    5. 3.5 Memory Map Summary
      1. Table 3-4 OMAP-L132 Top Level Memory Map
    6. 3.6 Pin Assignments
      1. 3.6.1 Pin Map (Bottom View)
    7. 3.7 Pin Multiplexing Control
    8. 3.8 Terminal Functions
      1. 3.8.1  Device Reset, NMI and JTAG
      2. 3.8.2  High-Frequency Oscillator and PLL
      3. 3.8.3  Real-Time Clock and 32-kHz Oscillator
      4. 3.8.4  DEEPSLEEP Power Control
      5. 3.8.5  External Memory Interface A (EMIFA)
      6. 3.8.6  DDR2/mDDR Controller
      7. 3.8.7  Serial Peripheral Interface Modules (SPI)
      8. 3.8.8  Programmable Real-Time Unit (PRU)
      9. 3.8.9  Enhanced Capture/Auxiliary PWM Modules (eCAP0)
      10. 3.8.10 Enhanced Pulse Width Modulators (eHRPWM)
      11. 3.8.11 Boot
      12. 3.8.12 Universal Asynchronous Receiver/Transmitters (UART0, UART1, UART2)
      13. 3.8.13 Inter-Integrated Circuit Modules(I2C0, I2C1)
      14. 3.8.14 Timers
      15. 3.8.15 Multichannel Audio Serial Ports (McASP)
      16. 3.8.16 Multichannel Buffered Serial Ports (McBSP)
      17. 3.8.17 Universal Serial Bus Modules (USB0)
      18. 3.8.18 Ethernet Media Access Controller (EMAC)
      19. 3.8.19 Multimedia Card/Secure Digital (MMC/SD)
      20. 3.8.20 General Purpose Input Output
      21. 3.8.21 Reserved and No Connect
      22. 3.8.22 Supply and Ground
    9. 3.9 Unused Pin Configurations
  4. 4Device Configuration
    1. 4.1 Boot Modes
    2. 4.2 SYSCFG Module
    3. 4.3 Pullup/Pulldown Resistors
  5. 5Specifications
    1. 5.1 Absolute Maximum Ratings Over Operating Junction Temperature Range (Unless Otherwise Noted)
    2. 5.2 Handling Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Notes on Recommended Power-On Hours (POH)
    5. 5.5 Electrical Characteristics Over Recommended Ranges of Supply Voltage and Operating Junction Temperature (Unless Otherwise Noted)
  6. 6Peripheral Information and Electrical Specifications
    1. 6.1  Parameter Information
      1. 6.1.1 Parameter Information Device-Specific Information
        1. 6.1.1.1 Signal Transition Levels
    2. 6.2  Recommended Clock and Control Signal Transition Behavior
    3. 6.3  Power Supplies
      1. 6.3.1 Power-On Sequence
      2. 6.3.2 Power-Off Sequence
    4. 6.4  Reset
      1. 6.4.1 Power-On Reset (POR)
      2. 6.4.2 Warm Reset
      3. 6.4.3 Reset Electrical Data Timings
    5. 6.5  Crystal Oscillator or External Clock Input
    6. 6.6  Clock PLLs
      1. 6.6.1 PLL Device-Specific Information
      2. 6.6.2 Device Clock Generation
      3. 6.6.3 Dynamic Voltage and Frequency Scaling (DVFS)
    7. 6.7  Interrupts
      1. 6.7.1 ARM CPU Interrupts
        1. 6.7.1.1 ARM Interrupt Controller (AINTC) Interrupt Signal Hierarchy
        2. 6.7.1.2 AINTC Hardware Vector Generation
        3. 6.7.1.3 AINTC Hardware Interrupt Nesting Support
        4. 6.7.1.4 AINTC System Interrupt Assignments
        5. 6.7.1.5 AINTC Memory Map
      2. 6.7.2 DSP Interrupts
    8. 6.8  Power and Sleep Controller (PSC)
      1. 6.8.1 Power Domain and Module Topology
        1. 6.8.1.1 Power Domain States
        2. 6.8.1.2 Module States
    9. 6.9  Enhanced Direct Memory Access Controller (EDMA3)
      1. 6.9.1 EDMA3 Channel Synchronization Events
      2. 6.9.2 EDMA3 Peripheral Register Descriptions
    10. 6.10 External Memory Interface A (EMIFA)
      1. 6.10.1 EMIFA Asynchronous Memory Support
      2. 6.10.2 EMIFA Synchronous DRAM Memory Support
      3. 6.10.3 EMIFA SDRAM Loading Limitations
      4. 6.10.4 EMIFA Connection Examples
      5. 6.10.5 External Memory Interface Register Descriptions
      6. 6.10.6 EMIFA Electrical Data/Timing
        1. Table 6-21 Timing Requirements for EMIFA SDRAM Interface
        2. Table 6-22 Switching Characteristics for EMIFA SDRAM Interface
        3. Table 6-23 Timing Requirements for EMIFA Asynchronous Memory Interface
    11. 6.11 DDR2/mDDR Memory Controller
      1. 6.11.1 DDR2/mDDR Memory Controller Electrical Data/Timing
      2. 6.11.2 DDR2/mDDR Memory Controller Register Description(s)
      3. 6.11.3 DDR2/mDDR Interface
        1. 6.11.3.1  DDR2/mDDR Interface Schematic
        2. 6.11.3.2  Compatible JEDEC DDR2/mDDR Devices
        3. 6.11.3.3  PCB Stackup
        4. 6.11.3.4  Placement
        5. 6.11.3.5  DDR2/mDDR Keep Out Region
        6. 6.11.3.6  Bulk Bypass Capacitors
        7. 6.11.3.7  High-Speed Bypass Capacitors
        8. 6.11.3.8  Net Classes
        9. 6.11.3.9  DDR2/mDDR Signal Termination
        10. 6.11.3.10 VREF Routing
        11. 6.11.3.11 DDR2/mDDR CK and ADDR_CTRL Routing
        12. 6.11.3.12 DDR2/mDDR Boundary Scan Limitations
    12. 6.12 Memory Protection Units
    13. 6.13 MMC / SD / SDIO (MMCSD0, MMCSD1)
      1. 6.13.1 MMCSD Peripheral Description
      2. 6.13.2 MMCSD Peripheral Register Description(s)
      3. 6.13.3 MMC/SD Electrical Data/Timing
        1. Table 6-42 Timing Requirements for MMC/SD (see and )
        2. Table 6-43 Switching Characteristics for MMC/SD (see through )
    14. 6.14 Multichannel Audio Serial Port (McASP)
      1. 6.14.1 McASP Peripheral Registers Description(s)
      2. 6.14.2 McASP Electrical Data/Timing
        1. 6.14.2.1 Multichannel Audio Serial Port 0 (McASP0) Timing
          1. Table 6-47 Timing Requirements for McASP0 (1.2V, 1.1V)
          2. Table 6-48 Timing Requirements for McASP0 (1.0V)
          3. Table 6-49 Switching Characteristics for McASP0 (1.2V, 1.1V)
          4. Table 6-50 Switching Characteristics for McASP0 (1.0V)
    15. 6.15 Multichannel Buffered Serial Port (McBSP)
      1. 6.15.1 McBSP Peripheral Register Description(s)
      2. 6.15.2 McBSP Electrical Data/Timing
        1. 6.15.2.1 Multichannel Buffered Serial Port (McBSP) Timing
          1. Table 6-52 Timing Requirements for McBSP0 [1.2V, 1.1V] (see )
          2. Table 6-53 Timing Requirements for McBSP0 [1.0V] (see )
          3. Table 6-54 Switching Characteristics for McBSP0 [1.2V, 1.1V] (see )
          4. Table 6-55 Switching Characteristics for McBSP0 [1.0V] (see )
          5. Table 6-56 Timing Requirements for McBSP1 [1.2V, 1.1V] (see )
          6. Table 6-57 Timing Requirements for McBSP1 [1.0V] (see )
          7. Table 6-58 Switching Characteristics for McBSP1 [1.2V, 1.1V] (see )
          8. Table 6-59 Switching Characteristics for McBSP1 [1.0V] (see )
          9. Table 6-60 Timing Requirements for McBSP0 FSR When GSYNC = 1 (see )
          10. Table 6-61 Timing Requirements for McBSP1 FSR When GSYNC = 1 (see )
    16. 6.16 Serial Peripheral Interface Ports (SPI0, SPI1)
      1. 6.16.1 SPI Peripheral Registers Description(s)
      2. 6.16.2 SPI Electrical Data/Timing
        1. 6.16.2.1 Serial Peripheral Interface (SPI) Timing
          1. Table 6-63 General Timing Requirements for SPI0 Master Modes
          2. Table 6-64 General Timing Requirements for SPI0 Slave Modes
          3. Table 6-71 General Timing Requirements for SPI1 Master Modes
          4. Table 6-72 General Timing Requirements for SPI1 Slave Modes
          5. Table 6-73 Additional SPI1 Master Timings, 4-Pin Enable Option
          6. Table 6-74 Additional SPI1 Master Timings, 4-Pin Chip Select Option
    17. 6.17 Inter-Integrated Circuit Serial Ports (I2C)
      1. 6.17.1 I2C Device-Specific Information
      2. 6.17.2 I2C Peripheral Registers Description(s)
      3. 6.17.3 I2C Electrical Data/Timing
        1. 6.17.3.1 Inter-Integrated Circuit (I2C) Timing
          1. Table 6-80 Timing Requirements for I2C Input
          2. Table 6-81 Switching Characteristics for I2C
    18. 6.18 Universal Asynchronous Receiver/Transmitter (UART)
      1. 6.18.1 UART Peripheral Registers Description(s)
      2. 6.18.2 UART Electrical Data/Timing
        1. Table 6-83 Timing Requirements for UART Receive (see )
        2. Table 6-84 Switching Characteristics Over Recommended Operating Conditions for UARTx Transmit (see )
    19. 6.19 Universal Serial Bus OTG Controller (USB0) [USB2.0 OTG]
      1. 6.19.1 USB0 [USB2.0] Electrical Data/Timing
        1. Table 6-86 Switching Characteristics Over Recommended Operating Conditions for USB0 [USB2.0] (see )
    20. 6.20 Ethernet Media Access Controller (EMAC)
      1. 6.20.1 EMAC Peripheral Register Description(s)
        1. 6.20.1.1 EMAC Electrical Data/Timing
          1. Table 6-91 Timing Requirements for MII_RXCLK (see )
          2. Table 6-92 Timing Requirements for MII_TXCLK (see )
          3. Table 6-93 Timing Requirements for EMAC MII Receive 10/100 Mbit/s (see )
          4. Table 6-94 Switching Characteristics Over Recommended Operating Conditions for EMAC MII Transmit 10/100 Mbit/s (see )
    21. 6.21 Management Data Input/Output (MDIO)
      1. 6.21.1 MDIO Register Description(s)
      2. 6.21.2 Management Data Input/Output (MDIO) Electrical Data/Timing
        1. Table 6-98 Timing Requirements for MDIO Input (see and )
        2. Table 6-99 Switching Characteristics Over Recommended Operating Conditions for MDIO Output (see )
    22. 6.22 Enhanced Capture (eCAP) Peripheral
      1. Table 6-101 Timing Requirements for Enhanced Capture (eCAP)
      2. Table 6-102 Switching Characteristics Over Recommended Operating Conditions for eCAP
    23. 6.23 Enhanced High-Resolution Pulse-Width Modulator (eHRPWM)
      1. 6.23.1 Enhanced Pulse Width Modulator (eHRPWM) Timing
        1. Table 6-104 Timing Requirements for eHRPWM
        2. Table 6-105 Switching Characteristics Over Recommended Operating Conditions for eHRPWM
      2. 6.23.2 Trip-Zone Input Timing
    24. 6.24 Timers
      1. 6.24.1 Timer Electrical Data/Timing
        1. Table 6-107 Timing Requirements for Timer Input (see )
        2. Table 6-108 Switching Characteristics Over Recommended Operating Conditions for Timer Output
    25. 6.25 Real Time Clock (RTC)
      1. 6.25.1 Clock Source
      2. 6.25.2 Real-Time Clock Register Descriptions
    26. 6.26 General-Purpose Input/Output (GPIO)
      1. 6.26.1 GPIO Register Description(s)
      2. 6.26.2 GPIO Peripheral Input/Output Electrical Data/Timing
        1. Table 6-111 Timing Requirements for GPIO Inputs (see )
        2. Table 6-112 Switching Characteristics Over Recommended Operating Conditions for GPIO Outputs (see )
      3. 6.26.3 GPIO Peripheral External Interrupts Electrical Data/Timing
        1. Table 6-113 Timing Requirements for External Interrupts (see )
    27. 6.27 Programmable Real-Time Unit Subsystem (PRUSS)
      1. 6.27.1 PRUSS Register Descriptions
    28. 6.28 Emulation Logic
      1. 6.28.1 JTAG Port Description
      2. 6.28.2 Scan Chain Configuration Parameters
      3. 6.28.3 Initial Scan Chain Configuration
        1. 6.28.3.1 Adding TAPS to the Scan Chain
      4. 6.28.4 IEEE 1149.1 JTAG
        1. 6.28.4.1 JTAG Peripheral Register Description(s) – JTAG ID Register (DEVIDR0)
        2. 6.28.4.2 JTAG Test-Port Electrical Data/Timing
          1. Table 6-125 Timing Requirements for JTAG Test Port (see )
          2. Table 6-126 Switching Characteristics Over Recommended Operating Conditions for JTAG Test Port (see )
      5. 6.28.5 JTAG 1149.1 Boundary Scan Considerations
  7. 7Device and Documentation Support
    1. 7.1 Device Nomenclature
    2. 7.2 Tools and Software
    3. 7.3 Documentation Support
    4. 7.4 社区资源
    5. 7.5 商标
    6. 7.6 静电放电警告
    7. 7.7 出口管制提示
    8. 7.8 术语表
  8. 8Mechanical Packaging and Orderable Information
    1. 8.1 Thermal Data for ZWT Package
    2. 8.2 Packaging Information

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  • ZWT|361
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6.27 Programmable Real-Time Unit Subsystem (PRUSS)

The Programmable Real-Time Unit Subsystem (PRUSS) consists of

  • Two Programmable Real-Time Units (PRU0 and PRU1) and their associated memories
  • An Interrupt Controller (INTC) for handling system interrupt events. The INTC also supports posting events back to the device level host CPU.
  • A Switched Central Resource (SCR) for connecting the various internal and external masters to the resources inside the PRUSS.

The two PRUs can operate completely independently or in coordination with each other. The PRUs can also work in coordination with the device level host CPU. This is determined by the nature of the program which is loaded into the PRUs instruction memory. Several different signaling mechanisms are available between the two PRUs and the device level host CPU.

The PRUs are optimized for performing embedded tasks that require manipulation of packed memory mapped data structures, handling of system events that have tight realtime constraints and interfacing with systems external to the device.

The PRUSS comprises various distinct addressable regions. Externally the subsystem presents a single 64Kbyte range of addresses. The internal interconnect bus (also called switched central resource, or SCR) of the PRUSS decodes accesses for each of the individual regions. The PRUSS memory map is documented in Table 6-114 and in Table 6-115. Note that these two memory maps are implemented inside the PRUSS and are local to the components of the PRUSS.

Table 6-114 Programmable Real-Time Unit Subsystem (PRUSS) Local Instruction Space Memory Map

BYTE ADDRESS PRU0 PRU1
0x0000 0000 - 0x0000 0FFF PRU0 Instruction RAM PRU1 Instruction RAM

Table 6-115 Programmable Real-Time Unit Subsystem (PRUSS) Local Data Space Memory Map

BYTE ADDRESS PRU0 PRU1
0x0000 0000 - 0x0000 01FF Data RAM 0(1) Data RAM 1(1)
0x0000 0200 - 0x0000 1FFF Reserved Reserved
0x0000 2000 - 0x0000 21FF Data RAM 1(1) Data RAM 0(1)
0x0000 2200 - 0x0000 3FFF Reserved Reserved
0x0000 4000 - 0x0000 6FFF INTC Registers INTC Registers
0x0000 7000 - 0x0000 73FF PRU0 Control Registers PRU0 Control Registers
0x0000 7400 - 0x0000 77FF Reserved Reserved
0x0000 7800 - 0x0000 7BFF PRU1 Control Registers PRU1 Control Registers
0x0000 7C00 - 0xFFFF FFFF Reserved Reserved
(1) Note that PRU0 accesses Data RAM0 at address 0x0000 0000, also PRU1 accesses Data RAM1 at address 0x0000 0000. Data RAM0 is intended to be the primary data memory for PRU0 and Data RAM1 is intended to be the primary data memory for PRU1. However for passing information between PRUs, each PRU can access the data ram of the ‘other’ PRU through address 0x0000 2000.

The global view of the PRUSS internal memories and control ports is documented in Table 6-116. The offset addresses of each region are implemented inside the PRUSS but the global device memory mapping places the PRUSS slave port in the address range 0x01C3 0000-0x01C3 FFFF. The PRU0 and PRU1 can use either the local or global addresses to access their internal memories, but using the local addresses will provide access time several cycles faster than using the global addresses. This is because when accessing via the global address the access needs to be routed through the switch fabric outside PRUSS and back in through the PRUSS slave port.

Table 6-116 Programmable Real-Time Unit Subsystem (PRUSS) Global Memory Map

BYTE ADDRESS REGION
0x01C3 0000 - 0x01C3 01FF Data RAM 0
0x01C3 0200 - 0x01C3 1FFF Reserved
0x01C3 2000 - 0x01C3 21FF Data RAM 1
0x01C3 2200 - 0x01C3 3FFF Reserved
0x01C3 4000 - 0x01C3 6FFF INTC Registers
0x01C3 7000 - 0x01C3 73FF PRU0 Control Registers
0x01C3 7400 - 0x01C3 77FF PRU0 Debug Registers
0x01C3 7800 - 0x01C3 7BFF PRU1 Control Registers
0x01C3 7C00 - 0x01C3 7FFF PRU1 Debug Registers
0x01C3 8000 - 0x01C3 8FFF PRU0 Instruction RAM
0x01C3 9000 - 0x01C3 BFFF Reserved
0x01C3 C000 - 0x01C3 CFFF PRU1 Instruction RAM
0x01C3 D000 - 0x01C3 FFFF Reserved

Each of the PRUs can access the rest of the device memory (including memory mapped peripheral and configuration registers) using the global memory space addresses
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