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ZHCSRX0H September 1983 – March 2023 OP07 , OP07C , OP07D

PRODUCTION DATA

6.4 Thermal Information

THERMAL METRIC⁽¹⁾		OP07x		UNIT
		D (SOIC)	P (PDIP)
		8 PINS	8 PINS
R_θJA	Junction-to-ambient thermal resistance	127.6	85	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	67.1	68.6	°C/W
R_θJB	Junction-to-board thermal resistance	71.4	55..6	°C/W
ψ_JT	Junction-to-top characterization parameter	18.7	38.3	°C/W
ψ_JB	Junction-to-board characterization parameter	70.6	55.2	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	—	—	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.