ZHCSOH5B December   1997  – August 2024 OPA134 , OPA2134 , OPA4134

PRODUCTION DATA  

  1.   1
  2. 1 特性
  3. 2 应用
  4. 3 说明
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information - OPA134
    5. 5.5 Thermal Information - OPA2134
    6. 5.6 Thermal Information - OPA4134
    7. 5.7 Electrical Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Feature Description
      1. 6.2.1 Total Harmonic Distortion
      2. 6.2.2 Distortion Measurements
      3. 6.2.3 Source Impedance and Distortion
      4. 6.2.4 Phase Reversal Protection
      5. 6.2.5 Output Current Limit
    3. 6.3 Functional Block Diagram
    4. 6.4 Device Functional Modes
      1. 6.4.1 Noise Performance
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Operating Voltage
      2. 7.1.2 Offset Voltage Trim
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Analog Filter Designer
        2. 8.1.1.2 TINA-TI™ 仿真软件（免费下载）
        3. 8.1.1.3 TI 参考设计
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 接收文档更新通知
    4. 8.4 支持资源
    5. 8.5 Trademarks
    6. 8.6 静电放电警告
    7. 8.7 术语表
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.5 Thermal Information - OPA2134

THERMAL METRIC(1) OPA2134 UNIT
D (SOIC) P (PDIP)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 160 71 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 75 50 °C/W
RθJB Junction-to-board thermal resistance 60 36 °C/W
ΨJT Junction-to-top characterization parameter 9 16 °C/W
ΨJB Junction-to-board characterization parameter 50 35 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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