ZHCSOD6E December 2003 – August 2023 OPA1632
PRODUCTION DATA
| THERMAL METRIC(1) | OPA1632 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | DGN (HVSSOP) | |||
| 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 126.3 | 57.6 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 67.3 | 76.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 69.8 | 30.0 | °C/W |
| ψJT | Junction-to-top characterization parameter | 19.5 | 4.0 | °C/W |
| ψJB | Junction-to-board characterization parameter | 69.0 | 29.9 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | N/A | 14.3 | °C/W |