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ZHCSRO1A february 2023 – july 2023 OPA1633

PRODUCTION DATA

封装选项

机械数据 (封装 | 引脚)

D|8
- MSOI002K
DGN|8
- MPDS046G

散热焊盘机械数据 (封装 | 引脚)

DGN|8
- PPTD388A

订购信息

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)⁽¹⁾⁽²⁾

		MIN	MAX	UNIT
V_S	Supply voltage		±18.5	V
	Supply turn on and turn off dV/dT⁽³⁾		1.7	V/µs
V_I	Input voltage		±V_S	V
I_O	Output current		150	mA
I_IN	Continuous input current		10	mA
V_ID	Differential input voltage		±1.5	V
T_J	Junction temperature		150	°C
T_A	Ambient temperature	–40	85	°C
T_stg	Storage temperature	–65	150	°C

(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality, performance, and shorten the device lifetime.

(2) The OPA1633 HVSSOP PowerPAD integrated circuit package incorporates a thermal pad on the underside of the chip. This thermal pad acts as a heat sink and must be connected to a thermally-dissipative plane for proper power dissipation. Failure to do so can result in exceeding the maximum junction temperature, which can permanently damage the device. See TI technical brief SLMA002 for more information about using the thermally-enhanced PowerPAD integrated circuit package.

(3) Stay below this specification to make sure that the edge-triggered ESD absorption devices across the supply pins remain off.