ZHCSGB7A June   2017  – November 2017 OPA1641-Q1 , OPA1642-Q1

PRODUCTION DATA.  

  1. 特性
  2. 应用
  3. 说明
    1.     Device Images
      1.      简化内部原理图
      2.      极为稳定的输入电容
  4. 修订历史记录
  5. Pin Configuration and Functions
    1.     Pin Functions: OPA1641-Q1
    2.     Pin Functions: OPA1642-Q1
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Phase Reversal Protection
      2. 7.3.2 Output Current Limit
      3. 7.3.3 EMI Rejection Ratio (EMIRR)
        1. 7.3.3.1 EMIRR IN+ Test Configuration
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Voltage
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Total Harmonic Distortion Measurements
      2. 8.1.2 Source Impedance and Distortion
      3. 8.1.3 Capacitive Load and Stability
      4. 8.1.4 Power Dissipation and Thermal Protection
      5. 8.1.5 Electrical Overstress
    2. 8.2 Typical Application
      1. 8.2.1 Single-Supply Electret Microphone Preamplifier for Speech
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
        1. 11.1.1.1 TINA-TI(免费软件下载)
        2. 11.1.1.2 TI 高精度设计
        3. 11.1.1.3 WEBENCH® 滤波器设计器
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 相关链接
    4. 11.4 接收文档更新通知
    5. 11.5 社区资源
    6. 11.6 商标
    7. 11.7 静电放电警告
    8. 11.8 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

Power Dissipation and Thermal Protection

The OPA164x-Q1 op amps are capable of driving 2-kΩ loads with power-supply voltages of up to ±18 V over the specified temperature range. In a single-supply configuration, where the load is connected to the negative supply voltage, the minimum load resistance is 2.8 kΩ at a supply voltage of 36 V. For lower supply voltages (either single-supply or symmetrical supplies), a lower load resistance can be used, as long as the output current does not exceed 13 mA; otherwise, the device short-circuit current-protection circuit can activate.

Internal power dissipation increases when operating at high supply voltages. Copper leadframe construction used in the OPA164x-Q1 series of devices improves heat dissipation compared to conventional materials. PCB layout can help reduce a possible increase in junction temperature. Wide copper traces help dissipate the heat by functioning as an additional heat sink. Temperature rise can be further minimized by soldering the devices directly to the PCB rather than using a socket.

Although the output current is limited by internal protection circuitry, accidental shorting one or more output channels of a device can result in excessive heating. For instance, when an output is shorted to midsupply, the typical short-circuit current of 36 mA leads to an internal power dissipation of over 600 mW at a supply of ±18 V. In case of a dual OPA1642-Q1 in an VSSOP-8 package (thermal resistance RθJA = 180°C/W), such a power dissipation results in the die temperature to be 220°C above ambient temperature, when both channels are shorted. This temperature increase destroys the device.

To prevent such excessive heating that can destroy the device, the OPA164x-Q1 series has an internal thermal shutdown circuit that shuts down the device if the die temperature exceeds approximately 180°C. When this thermal shutdown circuit activates, a built-in hysteresis of 15°C ensures that the die temperature must drop to approximately 165°C before the device switches on again.