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ZHCSJH0C March 2019 – September 2022 OPA1655 , OPA1656

PRODUCTION DATA

6.5 Thermal Information: OPA1656

THERMAL METRIC⁽¹⁾		OPA1656	UNIT
		D (SOIC)
		8 PINS
R_θJA	Junction-to-ambient thermal resistance	119.9	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	51.8	°C/W
R_θJB	Junction-to-board thermal resistance	65.4	°C/W
ψ_JT	Junction-to-top characterization parameter	10.0	°C/W
ψ_JB	Junction-to-board characterization parameter	64.2	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.