ZHCSG25E January   2017  – December 2022 OPA1677 , OPA1678 , OPA1679

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA1677
    5. 6.5 Thermal Information: OPA1678
    6. 6.6 Thermal Information: OPA1679
    7. 6.7 Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Phase Reversal Protection
      2. 7.3.2 Electrical Overstress
      3. 7.3.3 EMI Rejection Ratio (EMIRR)
        1. 7.3.3.1 EMIRR IN+ Test Configuration
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Voltage
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Capacitive Loads
    2. 8.2 Typical Applications
      1. 8.2.1 Phantom-Powered Preamplifier for Piezo Contact Microphones
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Power Supply
          2. 8.2.1.2.2 Input Network
          3. 8.2.1.2.3 Gain
          4. 8.2.1.2.4 Output Network
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Phono Preamplifier for Moving Magnet Cartridges
      3. 8.2.3 Single-Supply Electret Microphone Preamplifier
      4. 8.2.4 Composite Headphone Amplifier
      5. 8.2.5 Differential Line Receiver With AC-Coupled Outputs
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Power Dissipation
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
        1. 9.1.1.1 PSpice® for TI
        2. 9.1.1.2 TINA-TI™ 仿真软件（免费下载）
        3. 9.1.1.3 DIP-Adapter-EVM
        4. 9.1.1.4 DIYAMP-EVM
        5. 9.1.1.5 TI 参考设计
        6. 9.1.1.6 滤波器设计工具
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 接收文档更新通知
    4. 9.4 支持资源
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 术语表
  10. 10Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision D (December 2021) to Revision E (December 2022)

  • 将 OPA1677 D（SOIC，8）封装从“预发布”更改为“量产数据”（正在供货）Go

Changes from Revision C (April 2019) to Revision D (December 2021)

  • 更新了整个文档中的表格、图和交叉参考的编号格式Go
  • 添加了 OPA1677 器件的量产数据（正在供货）和相关内容Go

Changes from Revision B (June 2018) to Revision C (April 2019)

  • 将 OPA1679 QFN 封装的状态更改为量产数据Go
  • Changed GPN BUF634A in Figure 8-6, Composite Headphone Amplifier (Single-Channel Shown) Go

Changes from Revision A (May 2018) to Revision B (June 2018)

  • 添加了内容：预发布 QFN (RUM) 封装Go

Changes from Revision * (February 2017) to Revision A (May 2018)

  • 向器件信息 表添加了 DRG (SON) 8 引脚封装Go
  • 向特性 列表添加了 SON-8 封装Go
  • Added DRG (SON) 8-pin pinout drawing to Pin Configuration and Functions sectionGo
  • Added thermal pad information to Pin Functions: OPA1678 tableGo
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