米6体育平台手机版

ZHCSG25E January 2017 – December 2022 OPA1677 , OPA1678 , OPA1679

PRODUCTION DATA

6.5 Thermal Information: OPA1678

THERMAL METRIC⁽¹⁾		OPA1678			UNIT
		D (SOIC)	DGK (VSSOP)	DRG (SON)
		8 PINS	8 PINS	8 PINS
R_θJA	Junction-to-ambient thermal resistance	144	219	66.9	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	77	79	54.5	°C/W
R_θJB	Junction-to-board thermal resistance	62	104	40.4	°C/W
ψ_JT	Junction-to-top characterization parameter	28	15	1.9	°C/W
ψ_JB	Junction-to-board characterization parameter	61	102	40.4	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	10.8	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.