米6体育平台手机版

ZHCSH60C June 2017 – October 2018 OPA1692

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		OPA1692		UNIT
		D (SOIC)	DGK (VSSOP)
		8 PINS	8 PINS
R_θJA	Junction-to-ambient thermal resistance	123.6	162.2	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	63.4	56.9	°C/W
R_θJB	Junction-to-board thermal resistance	67.0	83.2	°C/W
ψ_JT	Junction-to-top characterization parameter	16.0	6.3	°C/W
ψ_JB	Junction-to-board characterization parameter	66.3	81.6	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.