ZHCSBX8I December 2013 – May 2018 OPA172 , OPA2172 , OPA4172
PRODUCTION DATA.
| THERMAL METRIC(1) | OPA172 | UNIT | |||
|---|---|---|---|---|---|
| D (SOIC) | DBV (SOT-23) | DCK (SC70) | |||
| 8 PINS | 5 PINS | 5 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 126.5 | 227.9 | 285.2 | °C/W |
| RθJC(top) | Junction-to-case(top) thermal resistance | 80.6 | 115.7 | 60.5 | °C/W |
| RθJB | Junction-to-board thermal resistance | 67.1 | 65.9 | 78.9 | °C/W |
| ψJT | Junction-to-top characterization parameter | 31.0 | 10.7 | 0.8 | °C/W |
| ψJB | Junction-to-board characterization parameter | 66.6 | 65.3 | 77.9 | °C/W |
| RθJC(bot) | Junction-to-case(bottom) thermal resistance | N/A | N/A | N/A | °C/W |