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ZHCS509E November 2011 – June 2018 OPA180 , OPA2180 , OPA4180

PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		OPA2180		UNIT
		D (SOIC)	DGK (MSOP)
		8 PINS	8 PINS
R_θJA	Junction-to-ambient thermal resistance	111	159.3	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	54.9	37.4	°C/W
R_θJB	Junction-to-board thermal resistance	51.7	48.5	°C/W
ψ_JT	Junction-to-top characterization parameter	9.3	1.2	°C/W
ψ_JB	Junction-to-board characterization parameter	51.1	77.1	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.