ZHCSIR5H September   2018  – August 2021 OPA210 , OPA2210

PRODUCTION DATA  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA210
    5. 6.5 Thermal Information: OPA2210
    6. 6.6 Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Input Protection
      3. 7.3.3 Noise Performance
      4. 7.3.4 Phase-Reversal Protection
      5. 7.3.5 Electrical Overstress
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Noise Calculations
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 System Example
      1. 8.3.1 Time Gain Control System for Ultrasound Applications
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 TINA-TI™ Simulation Software (Free Download)
        2. 11.1.1.2 DIP Adapter EVM
        3. 11.1.1.3 Universal Operational Amplifier EVM
        4. 11.1.1.4 TI Precision Designs
        5. 11.1.1.5 WEBENCH® Filter Designer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 接收文档更新通知
    4. 11.4 支持资源
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 术语表
  12. 12Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

4 Revision History

Changes from Revision G (April 2021) to Revision H (August 2021)

  • 将 OPA210 DBV (SOT-23-5) 和 DGK (VSSOP-8) 封装从预告信息（预发布）更改为量产数据（正在供货）Go

Changes from Revision F (January 2021) to Revision G (April 2021)

  • 将 OPA210 D (SOIC-8) 封装从预告信息（预发布）更改为量产数据（正在供货）Go
  • 添加了 OPA210 DBV (SOT-23-5) 封装，作为预告信息（预发布）Go

Changes from Revision E (Novembver 2020) to Revision F (January 2021)

  • 添加了采用 D 和 DGK 封装的 OPA210 器件，作为预告信息（预发布）Go

Changes from Revision D (January 2020) to Revision E (November 2020)

  • 将 OPA2210 DRG 封装从预告信息（预发布）更改为量产数据（正在供货）Go
  • Changed Figure 7-2 to show correct units in X- and Y-axis labelsGo

Changes from Revision C (September 2019) to Revision D (January 2020)

  • 向数据表添加了 OPA2210 DRG 封装，作为预告信息（预发布）Go

Changes from Revision B (March 2019) to Revision C (September 2019)

  • 将“super-ß”（超级 ß）更改为“super beta”（超级 ß），以便于搜索Go
  • 添加了 SOIC 封装Go

Changes from Revision A (December 2018) to Revision B (February 2019)

  • Changed "OPAx145" to "OPA2210"Go
  • Fixed link to TIDA-01427 Go

Changes from Revision * (September 2018) to Revision A (December 2018)

  • 首次发布量产数据数据表Go
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