5 Pin Configuration and Functions

Figure 5-1 OPA140: D Package, 8-Pin SOIC and DGK Package, 8-Pin VSSOP (Top View)

Figure 5-2 OPA140: DBV Package, 5-Pin SOT-23 (Top View)

Table 5-1 Pin Functions: OPA140

PIN			TYPE	DESCRIPTION
NAME	OPA140
NAME	D (SOIC), DGK (VSSOP)	DBV (SOT)
+IN	3	3	Input	Noninverting input
–IN	2	4	Input	Inverting input
NC	1, 5, 8	—	—	No internal connection (can be left floating)
OUT	6	1	Output	Output
V+	7	5	—	Positive (highest) power supply
V–	4	2	—	Negative (lowest) power supply

Figure 5-3 OPA2140: D Package, 8-Pin SOIC and DGK Package, 8-Pin VSSOP (Top View)

Figure 5-5 OPA4140: D Package, 14-Pin SOIC and PW Package, 14-Pin TSSOP (Top View)

Figure 5-4 OPA2140: DRG Package, 8-Pin SON (Top View)

Table 5-2 Pin Functions: OPA2140 and OPA4140

PIN			TYPE	DESCRIPTION
NAME	OPA2140	OPA4140
NAME	D (SOIC), DGK (VSSOP), DRG (SON)	D (SOIC), PW (TSSOP)
+IN A	3	3	Input	Noninverting input, channel A
+IN B	5	5	Input	Noninverting input, channel B
+IN C	—	10	Input	Noninverting input, channel C
+IN D	—	12	Input	Noninverting input, channel D
–IN A	2	2	Input	Inverting input, channel A
–IN B	6	6	Input	Inverting input, channel B
–IN C	—	9	Input	Inverting input, channel C
–IN D	—	13	Input	Inverting input, channel D
OUT A	1	1	Output	Output, channel A
OUT B	7	7	Output	Output, channel B
OUT C	—	8	Output	Output, channel C
OUT D	—	14	Output	Output, channel D
V+	8	4	—	Positive (highest) power supply
V–	4	11	—	Negative (lowest) power supply
Thermal Pad	DRG Package only	—	—	Thermal pad is internally connected to V−. Solder the thermal pad to a heat spreading plane on the board connected to V−. For DRG package only.