ZHCSE93 September 2015 OPA2171-EP
PRODUCTION DATA.
MIN | MAX | UNIT | ||
---|---|---|---|---|
Supply voltage | ±20 | V | ||
Signal input pins | Voltage | (V–) – 0.5 | (V+) + 0.5 | V |
Current | –10 | 10 | mA | |
Output short circuit(2) | Continuous | |||
Junction temperature | 150 | °C | ||
Storage temperature, Tstg | –65 | 150 | °C |
VALUE | UNIT | |||
---|---|---|---|---|
V(ESD) | Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±4000 | V |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±750 |
MIN | NOM | MAX | UNIT | ||
---|---|---|---|---|---|
Supply voltage (V+ – V–) | 4.5 (±2.25) | 36 (±18) | V | ||
Operating temperature, TJ | –55 | 125 | °C |
THERMAL METRIC(1) | OPA2171-EP | UNIT | |
---|---|---|---|
DCU (VSSOP) | |||
8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 175.2 | °C/W |
RθJC(top) | Junction-to-case(top) thermal resistance | 74.9 | °C/W |
RθJB | Junction-to-board thermal resistance | 22.2 | °C/W |
ψJT | Junction-to-top characterization parameter | 1.6 | °C/W |
ψJB | Junction-to-board characterization parameter | 22.8 | °C/W |
RθJC(bot) | Junction-to-case(bottom) thermal resistance | N/A | °C/W |
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | ||
---|---|---|---|---|---|---|---|
OFFSET VOLTAGE | |||||||
Input offset voltage | VOS | 0.25 | ±1.8 | mV | |||
Over temperature | TJ = –55°C to 125°C | 0.3 | ±2 | mV | |||
Drift | dVOS/dT | TJ = –55°C to 125°C | 0.3 | µV/°C | |||
vs power supply | PSRR | VS = 4 to 36 V, TA = –55°C to 125°C | 1 | ±5 | µV/V | ||
Channel separation, dc | dc | 5 | µV/V | ||||
INPUT BIAS CURRENT | |||||||
Input bias current | IB | ±8 | ±15 | pA | |||
Over temperature | TJ = –55°C to 125°C | ±4 | nA | ||||
Input offset current | IOS | ±4 | pA | ||||
Over temperature | TJ = –55°C to 125°C | ±4 | nA | ||||
NOISE | |||||||
Input voltage noise | ƒ = 0.1 to 10 Hz | 3 | µVPP | ||||
Input voltage noise density | en | ƒ = 100 Hz | 25 | nV/√Hz | |||
ƒ = 1 kHz | 14 | nV/√Hz | |||||
INPUT VOLTAGE | |||||||
Common-mode voltage range(1) | VCM | (V–) – 0.1 V | (V+) – 2 V | V | |||
Common-mode rejection ratio | CMRR | VS = ±2 V, (V–) – 0.1 V < VCM < (V+) – 2 V, TJ = –55°C to 125°C |
87 | 104 | dB | ||
VS = ±18 V, (V–) – 0.1 V < VCM < (V+) – 2 V, TJ = –55°C to 125°C |
104 | 120 | dB | ||||
INPUT IMPEDANCE | |||||||
Differential | 100 || 3 | MΩ || pF | |||||
Common-mode | 6 || 3 | 1012Ω || pF | |||||
OPEN-LOOP GAIN | |||||||
Open-loop voltage gain | AOL | VS = 4 to 36 V, (V–) + 0.35 V < VO < (V+) – 0.35 V, TJ = –55°C to 125°C | 110 | 130 | dB | ||
FREQUENCY RESPONSE | |||||||
Gain bandwidth product | GBP | 3.0 | MHz | ||||
Slew rate | SR | G = +1 | 1.5 | V/µs | |||
Settling time | tS | To 0.1%, VS = ±18 V, G = +1, 10-V step | 6 | µs | |||
To 0.01% (12 bit), VS = ±18 V, G = +1, 10-V step | 10 | µs | |||||
Overload recovery time | VIN × Gain > VS | 2 | µs | ||||
Total harmonic distortion + noise | THD+N | G = +1, ƒ = 1kHz, VO = 3VRMS | 0.0002% | ||||
OUTPUT | |||||||
Voltage output swing from rail | VO | VS = 5 V, RL = 10 kΩ | 30 | mV | |||
Over temperature | RL = 10 kΩ, AOL ≥ 110 dB, TJ = –55°C to 125°C |
(V–) + 0.35 | (V+) – 0.35 | V | |||
Short-circuit current | ISC | +25/–35 | mA | ||||
Capacitive load drive | CLOAD | See Typical Characteristics | pF | ||||
Open-loop output resistance | RO | ƒ = 1 MHz, IO = 0 A | 150 | Ω | |||
POWER SUPPLY | |||||||
Specified voltage range | VS | 2.7 | 36 | V | |||
Quiescent current per amplifier | IQ | IO = 0 A | 475 | 595 | µA | ||
Over temperature | IO = 0 A, TJ = –55°C to 125°C | 650 | µA | ||||
TEMPERATURE | |||||||
Operating temperature | TJ | –55 | 125 | °C |
DESCRIPTION | FIGURE |
---|---|
Offset Voltage Production Distribution | Figure 1 |
Offset Voltage Drift Distribution | Figure 2 |
Offset Voltage vs Temperature | Figure 3 |
Offset Voltage vs Common-Mode Voltage | Figure 4 |
Offset Voltage vs Common-Mode Voltage (Upper Stage) | Figure 5 |
Offset Voltage vs Power Supply | Figure 6 |
IB and IOS vs Common-Mode Voltage | Figure 7 |
Input Bias Current vs Temperature | Figure 8 |
Output Voltage Swing vs Output Current (Maximum Supply) | Figure 9 |
CMRR and PSRR vs Frequency (Referred-to Input) | Figure 10 |
CMRR vs Temperature | Figure 11 |
PSRR vs Temperature | Figure 12 |
0.1-Hz to 10-Hz Noise | Figure 13 |
Input Voltage Noise Spectral Density vs Frequency | Figure 14 |
THD+N Ratio vs Frequency | Figure 15 |
THD+N vs Output Amplitude | Figure 16 |
Quiescent Current vs Temperature | Figure 17 |
Quiescent Current vs Supply Voltage | Figure 18 |
Open-Loop Gain and Phase vs Frequency | Figure 19 |
Closed-Loop Gain vs Frequency | Figure 20 |
Open-Loop Gain vs Temperature | Figure 21 |
Open-Loop Output Impedance vs Frequency | Figure 22 |
Small-Signal Overshoot vs Capacitive Load (100-mV Output Step) | Figure 23, Figure 24 |
No Phase Reversal | Figure 25 |
Positive Overload Recovery | Figure 26 |
Negative Overload Recovery | Figure 27 |
Small-Signal Step Response (100 mV) | Figure 28, Figure 29 |
Large-Signal Step Response | Figure 30, Figure 31 |
Large-Signal Settling Time (10-V Positive Step) | Figure 32 |
Large-Signal Settling Time (10-V Negative Step) | Figure 33 |
Short-Circuit Current vs Temperature | Figure 34 |
Maximum Output Voltage vs Frequency | Figure 35 |
Channel Separation vs Frequency | Figure 36 |