ZHCS509E November 2011 – June 2018 OPA180 , OPA2180 , OPA4180
PRODUCTION DATA.
| THERMAL METRIC(1) | OPA180 | UNIT | |||
|---|---|---|---|---|---|
| D (SOIC) | DBV (SOT-23) | DGK (MSOP) | |||
| 8 PINS | 5 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 115.8 | 158.8 | 180.4 | °C/W |
| RθJC(top) | Junction-to-case(top) thermal resistance | 60.1 | 60.7 | 67.9 | °C/W |
| RθJB | Junction-to-board thermal resistance | 56.4 | 44.8 | 102.1 | °C/W |
| ψJT | Junction-to-top characterization parameter | 12.8 | 1.6 | 10.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 55.9 | 4.2 | 100.3 | °C/W |
| RθJC(bot) | Junction-to-case(bottom) thermal resistance | N/A | N/A | N/A | °C/W |