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ZHCSFV2D December 2016 – December 2018 OPA187 , OPA2187 , OPA4187

UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.

THERMAL METRIC⁽¹⁾		OPA4187			UNIT
		14 PINS		16 PINS
		PW (TSSOP)	D (SOIC)	RUM (WQFN)
R_θJA	Junction-to-ambient thermal resistance	107.8	83.8	35.3	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	29.6	70.7	32.7	°C/W
R_θJB	Junction-to-board thermal resistance	52.6	59.5	12.9	°C/W
ψ_JT	Junction-to-top characterization parameter	1.5	11.6	0.3	°C/W
ψ_JB	Junction-to-board characterization parameter	51.6	37.7	12.9	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	n/a	n/a	3.3	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.