ZHCSLB1F april   2020  – march 2023 OPA205 , OPA2205 , OPA4205

PRODMIX  

  1. 1 特性
  2. 2 应用
  3. 3 说明
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA205
    5. 6.5 Thermal Information: OPA2205
    6. 6.6 Thermal Information: OPA4205
    7. 6.7 Electrical Characteristics: VS = ±5 V
    8. 6.8 Electrical Characteristics: VS = ±15 V
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Typical Specifications and Distributions
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input Offset Trimming
      2. 8.3.2 Lower Input Bias With Super-Beta Inputs
      3. 8.3.3 Overload Power Limiter
      4. 8.3.4 EMI Rejection
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 High-Precision Signal-Chain Input Buffer
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Discrete, Two-Op-Amp Instrumentation Amplifier
      3. 9.2.3 Second-Order Low-Pass Filter
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 PSpice® for TI
    2. 10.2 文档支持
      1. 10.2.1 相关文档
    3. 10.3 接收文档更新通知
    4. 10.4 支持资源
    5. 10.5 Trademarks
    6. 10.6 静电放电警告
    7. 10.7 术语表
  11. 11Mechanical, Packaging, and Orderable Information

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.5 Thermal Information: OPA2205

THERMAL METRIC(1) OPA2205 UNIT
D (SOIC) DGK (VSSOP)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 126.9 175.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 67.1 63.1 °C/W
RθJB Junction-to-board thermal resistance 70.3 97.2 °C/W
ψJT Junction-to-top characterization parameter 18.8 7.8 °C/W
ψJB Junction-to-board characterization parameter 69.5 95.5 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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