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ZHCSLB1F april 2020 – march 2023 OPA205 , OPA2205 , OPA4205

PRODMIX

6.6 Thermal Information: OPA4205

THERMAL METRIC⁽¹⁾		OPA4205		UNIT
		D (SOIC)	PW (TSSOP)
		14 PINS	14 PINS
R_θJA	Junction-to-ambient thermal resistance	86.5	117.1	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	38.5	36.0	°C/W
R_θJB	Junction-to-board thermal resistance	43.5	59.3	°C/W
ψ_JT	Junction-to-top characterization parameter	7.4	2.6	°C/W
ψ_JB	Junction-to-board characterization parameter	42.9	58.3	°C/W
R_θJC(bot)	Junction-to-case (bottom) thermal resistance	N/A	N/A	°C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.