米6体育平台手机版

ZHCSIR5H September 2018 – August 2021 OPA210 , OPA2210

PRODUCTION DATA

6.4 Thermal Information: OPA210

THERMAL METRIC⁽¹⁾		OPA210			UNIT
		D (SOIC)	DGK (VSSOP)	DBV (SOT-23)
		8 PINS	8 PINS	5 PINS
R_θJA	Junction-to-ambient thermal resistance	131.2	171.3	180.4	°C/W
R_θJC(top)	Junction-to-case (top) thermal resistance	71.6	64.7	67.9	°C/W
R_θJB	Junction-to-board thermal resistance	74.6	92.4	102.1	°C/W
ψ_JT	Junction-to-top characterization parameter	22.4	10.4	10.4	°C/W
ψ_JB	Junction-to-board characterization parameter	73.8	90.9	100.3	°C/W
R_θJC(bottom)	Junction-to-case (bottom) thermal resistance	N/A	N/A	N/A	°C/W

(1) For more information about traditional and new thermalmetrics, see the Semiconductor and ICPackage Thermal Metrics application report.