ZHCSIR5H September 2018 – August 2021 OPA210 , OPA2210
PRODUCTION DATA
| THERMAL METRIC(1) | OPA2210 | UNIT | |||
|---|---|---|---|---|---|
| D (SOIC) | DGK (VSSOP) | DRG (SON) | |||
| 8 PINS | 8 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 126.1 | 132.7 | 52.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 65.7 | 38.5 | 51.8 | °C/W |
| RθJB | Junction-to-board thermal resistance | 69.5 | 52.1 | 24.8 | °C/W |
| ψJT | Junction-to-top characterization parameter | 17.4 | 2.4 | 1.1 | °C/W |
| ψJB | Junction-to-board characterization parameter | 68.9 | 52.8 | 24.8 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | 9.0 | °C/W |