ZHCSED2 November 2015 OPA2211-EP
PRODUCTION DATA.
5 Pin Configuration and Functions
DRG Package
8-Pin WSON
Top View
1. Exposed thermal die pad on underside; connect thermal die pad to V–. Soldering the thermal pad improves heat dissipation and provides specified performance
Pin Functions
| PIN | I/O | DESCRIPTION | |
|---|---|---|---|
| NAME | NO. | ||
| +IN A | 3 | I | Noninverting input for channel A |
| –IN A | 2 | I | Inverting input for channel A |
| +IN B | 5 | I | Noninverting input for channel B |
| –IN B | 6 | I | Inverting input for channel B |
| OUT A | 1 | O | Output terminal for channel A |
| OUT B | 7 | O | Output terminal for channel B |
| V+ | 8 | — | Positive supply voltage |
| V– | 4 | — | Negative supply voltage |