ZHCSJ37 December 2018 OPA2313-Q1
PRODUCTION DATA.
THERMAL METRIC(1) | OPA2313-Q1 | UNIT | ||
---|---|---|---|---|
D (SOIC) | DGK (VSSOP) | |||
8 Pins | 8 Pins | |||
RθJA | Junction-to-ambient thermal resistance | 138.4 | 191.2 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 89.5 | 61.9 | °C/W |
RθJB | Junction-to-board thermal resistance | 78.6 | 111.9 | °C/W |
ψJT | Junction-to-top characterization parameter | 29.9 | 5.1 | °C/W |
ψJB | Junction-to-board characterization parameter | 78.1 | 110.2 | °C/W |