ZHCSH14A November   2017  – December 2017 OPA2333P

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      双向低侧电流分流放大器
      2.      失调电压与温度间的关系
  4. 4 修订历史记录
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information: OPA2333P
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Operating Voltage
      2. 7.3.2 Input Voltage
      3. 7.3.3 Internal Offset Correction
      4. 7.3.4 Achieving Output Swing to the Op Amp Negative Rail
      5. 7.3.5 Specified Start-Up Performance
      6. 7.3.6 WSON Package
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Bidirectional Current-Sensing
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 High-Side Voltage-to-Current (V-I) Converter
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Other Applications
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 General Layout Guidelines
      2. 10.1.2 WSON (DFN) Layout Guidelines
    2. 10.2 Layout Example
  11. 11器件和文档支持
    1. 11.1 器件支持
      1. 11.1.1 开发支持
    2. 11.2 文档支持
      1. 11.2.1 相关文档
    3. 11.3 接收文档更新通知
    4. 11.4 社区资源
    5. 11.5 商标
    6. 11.6 静电放电警告
    7. 11.7 Glossary
  12. 12机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

6.4 Thermal Information: OPA2333P

THERMAL METRIC(1)OPA2333PUNIT
DSG (WSON)
8 PINS
RθJA Junction-to-ambient thermal resistance 74.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 93.5 °C/W
RθJB Junction-to-board thermal resistance 41.1 °C/W
ΨJT Junction-to-top characterization parameter 4.3 °C/W
ΨJB Junction-to-board characterization parameter 41.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 15.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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