7.3.6 WSON Package

The OPA2333P is offered in an WSON-8 package (also known as DFN). The WSON is a QFN package with lead contacts on only two sides of the bottom of the package. This leadless package maximizes board space and enhances thermal and electrical characteristics through an exposed pad.

WSON packages are physically small, have a smaller routing area, improved thermal performance, and improved electrical parasitics. Additionally, the absence of external leads eliminates bent-lead issues.

The WSON package can be easily mounted using standard PCB assembly techniques. See application reports QFN/SON PCB Attachment and Quad Flatpack No-Lead Logic Packages, both available for download at www.ti.com.