ZHCSI38E March 2001 – April 2018 OPA2355 , OPA3355 , OPA355
PRODUCTION DATA.
| THERMAL METRIC(1) | OPA355 | UNIT | ||
|---|---|---|---|---|
| D (SOIC) | DBV (SOT-23) | |||
| 8 PINS | 6 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 136.3 | 166.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 76.7 | 104.3 | °C/W |
| RθJB | Junction-to-board thermal resistance | 79.8 | 38.7 | °C/W |
| ψJT | Junction-to-top characterization parameter | 26.3 | 23.4 | °C/W |
| ψJB | Junction-to-board characterization parameter | 79 | 38.5 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | °C/W |