ZHCS042C April 2011 – March 2021 OPA2376-Q1 , OPA376-Q1 , OPA4376-Q1
PRODUCTION DATA
| THERMAL METRIC(1) | OPA376-Q1 | UNIT | |||
|---|---|---|---|---|---|
| DCK (SC70) | DBV (SOT-23) | D (SOIC) | |||
| 5 PINS | 5 PINS | 8 PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 267 | 273.8 | 100.1 | °C/W |
| RθJC(top) | Junction-to-case (top) thermal resistance | 80.9 | 126.8 | 42.4 | °C/W |
| RθJB | Junction-to-board thermal resistance | 54.8 | 85.9 | 41 | °C/W |
| ψJT | Junction-to-top characterization parameter | 1.2 | 10.9 | 4.8 | °C/W |
| ψJB | Junction-to-board characterization parameter | 54.1 | 84.9 | 40.3 | °C/W |
| RθJC(bot) | Junction-to-case (bottom) thermal resistance | n/a | n/a | n/a | °C/W |