ZHCSWB3A September   2000  – June 2024 OPA2241 , OPA2251 , OPA241 , OPA251 , OPA4241 , OPA4251

PRODUCTION DATA  

  1.   1
  2. 1特性
  3. 2应用
  4. 3说明
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information for OPA241 and OPA251
    4. 5.4 Thermal Information for OPA2241 and OPA2251
    5. 5.5 Thermal Information for OPA4241 and OPA4251
    6. 5.6 Electrical Characteristics for VS = 2.7V to 5V
    7. 5.7 Electrical Characteristics for VS = ±15V
    8. 5.8 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Applications Information
      1. 6.1.1 Operating Voltage
      2. 6.1.2 Offset Voltage Trim
      3. 6.1.3 Capacitive Load and Stability
  8. 7Device and Documentation Support
    1. 7.1 接收文档更新通知
    2. 7.2 支持资源
    3. 7.3 Trademarks
    4. 7.4 静电放电警告
    5. 7.5 术语表
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

封装选项

请参考 PDF 数据表获取器件具体的封装图。

机械数据 (封装 | 引脚)
  • D|8
  • P|8
散热焊盘机械数据 (封装 | 引脚)
订购信息

5.4 Thermal Information for OPA2241 and OPA2251

THERMAL METRIC(1) OPA2241 AND OPA2251 UNIT
D (SOIC) P (PDIP)
8 PINS 8 PINS
RθJA Junction-to-ambient thermal resistance 150 100 ℃/W
RθJC(top) Junction-to-case (top) thermal resistance 61.0 N/A ℃/W
RθJB Junction-to-board thermal resistance 68.3 N/A ℃/W
ψJT Junction-to-top characterization parameter 10.8 N/A ℃/W
ψJB Junction-to-board characterization parameter 67.4 N/A ℃/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A ℃/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
千亿体育app官网登录(中国)官方网站IOS/安卓通用版/手机APP | 米乐app下载官网（中国）|ios|Android/通用版APP最新版 | 米乐|米乐·M6（中国大陆）官方网站 | 千亿体育登陆地址 | 华体会体育（中国）HTH·官方网站 | 千赢qy国际_全站最新版千赢qy国际V6.2.14安卓/IOS下载 | 18新利网v1.2.5|中国官方网站 | bob电竞真人（中国官网）安卓/ios苹果/电脑版【1.97.95版下载】 | 千亿体育app官方下载(中国)官方网站IOS/安卓/手机APP下载安装 |