ZHCSJY2A June   2019  – September 2019 OPA2834

PRODUCTION DATA.  

  1. 1 特性
  2. 2 应用
  3. 3 说明
    1.     Device Images
      1.      1kHz FFT 图（VOUT = 1VRMS，RL = 100kΩ，G = 1）
      2.      低侧电流分流监控
  4. 4 修订历史记录
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics: 3V to 5V
    6. 7.6 Typical Characteristics: Vs = 5 V
    7. 7.7 Typical Characteristics: VS = 3.0 V
    8. 7.8 Typical Characteristics: ±2.5-V to ±1.5-V Split Supply
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Input Common-Mode Voltage Range
      2. 8.3.2 Output Voltage Range
      3. 8.3.3 Low-Power Applications and the Effects of Resistor Values on Bandwidth
      4. 8.3.4 Driving Capacitive Loads
    4. 8.4 Device Functional Modes
      1. 8.4.1 Split-Supply Operation (±1.35 V to ±2.7 V)
      2. 8.4.2 Single-Supply Operation (2.7 V to 5.4 V)
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Noninverting Amplifier
      2. 9.1.2 Inverting Amplifier
    2. 9.2 Typical Applications
      1. 9.2.1 Low-Side Current Sensing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
      2. 9.2.2 Field Transmitter Sensor Interface
      3. 9.2.3 Ultrasonic Flow Meters
      4. 9.2.4 Microphone Pre-Amplifier
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12器件和文档支持
    1. 12.1 文档支持
      1. 12.1.1 相关文档
    2. 12.2 接收文档更新通知
    3. 12.3 社区资源
    4. 12.4 商标
    5. 12.5 静电放电警告
    6. 12.6 Glossary
  13. 13机械、封装和可订购信息

封装选项

机械数据 (封装 | 引脚)
散热焊盘机械数据 (封装 | 引脚)
订购信息

7.4 Thermal Information

THERMAL METRIC(1) OPA2834 UNIT
DGK (VSSOP)
8 PINS
RθJA Junction-to-ambient thermal resistance 192.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 79.3 °C/W
RθJB Junction-to-board thermal resistance 114.3 °C/W
ΨJT Junction-to-top characterization parameter 15.7 °C/W
YJB Junction-to-board characterization parameter 112.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.
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